Resist Composition for Thick Film Formation With Stable Active Content
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing photoresist materials struggle to form resist films suitable for various devices due to differing requirements, particularly in forming thick films for three-dimensional structure devices, and existing compositions face challenges in achieving optimal active component content for efficient film formation.
Innovation Solution
A resist composition containing a resin and solvent with specific compounds, limited active component content, and optional additives like photosensitizers and acid generating agents, forming a resist film through application and heat treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the active component content is increased to improve film formation efficiency, then the film formation efficiency is improved, but the cost increases and storage stability deteriorates
Solution Approach 1:
The patent optimizes the active component content to a specific range (5-40 wt%) based on resin type, balancing film formation efficiency and storage stability. This parameter optimization resolves the contradiction by identifying the optimal concentration range where both productivity and reliability are satisfied simultaneously.
Solution Approach 2:
The patent applies different active component content ranges for different resin types (e.g., higher content for novolac resin, lower for polyhydroxystyrene resin). This localized optimization allows each resin system to achieve its optimal performance balance, resolving the contradiction in a context-specific manner.
2Length of stationary object
If a thick resist film is formed to meet three-dimensional structure device requirements, then the film thickness is increased, but the manufacturing complexity increases
Solution Approach 1:
The patent incorporates dissolution inhibitors and specific resin structures that prevent premature film degradation during the coating process. This preliminary protection allows thick films to be formed without requiring complex manufacturing processes, as the film maintains its integrity throughout the formation process.
Solution Approach 2:
The patent uses composite resin systems combining multiple polymer types (e.g., novolac resin with polyhydroxystyrene resin) to achieve both thick film formation and manufacturing simplicity. The composite material properties enable single-step coating processes that would otherwise require multiple complex steps.
3Reliability
If different photoresist materials are used for different device types to meet specific requirements, then the device performance is improved, but the material selection complexity and production cost increase
Solution Approach 1:
The patent develops a universal resist composition system that can form films of different thicknesses and properties by adjusting the active component content and resin ratio, rather than requiring completely different materials for different applications. This multi-functional system reduces material selection complexity while maintaining device performance.
Solution Approach 2:
The patent enables dynamic adjustment of resist film properties by varying the active component content and resin composition ratios. This dynamic formulation approach allows a single base composition to adapt to different device requirements, reducing the need for multiple specialized materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of suitable resist films for diverse devices, including thick films, while maintaining economic advantages and effective film formation.
Implementation Method 1
a resist composition which contains a resin and a solvent including a compound having a specific structure
Implementation Method 2
step (2): a step of performing heat treatment after step (1)
Data Source
AI summary
A resist composition includes: (A) a resin; and (B) a solvent containing: (B1) a compound represented by the following general formula (b-1), wherein the content of the active component is 45% by mass or less based on the total amount of the resist composition:wherein R0 is an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an acyl group having 1 to 10 carbon atoms, and R1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.