Resist Composition for Electron Beam Multibeam Exposure
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Solution Overview
Problem
Current electron beam multibeam exposure methods struggle to achieve both low line width roughness (LWR) and high resolution for ultrafine patterns, particularly in high exposure amount ranges, leading to increased exposure time and reduced productivity in semiconductor manufacturing.
Innovation Solution
A pattern forming method using an actinic ray-sensitive or radiation-sensitive resin composition with a molar ratio of acid diffusion control agent to photoacid generator of 0.3 or greater, combined with simultaneous electron beam irradiation, to enhance LWR performance and resolution while reducing exposure time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electron beam multibeam exposure is performed to increase exposure amount and reduce exposure time, then productivity is improved, but line width roughness (LWR) performance and resolution deteriorate
Solution Approach 1:
The patent applies parameter changes by optimizing the molar ratio of acid diffusion control agent to photoacid generator (setting it to 0.3 or greater) and adjusting the content of acid diffusion control agent (5-50 mass%) to achieve optimal LWR performance and resolution while maintaining high exposure amount capability in multibeam exposure
Solution Approach 2:
The patent uses composite materials by formulating a resist composition containing multiple components including acid diffusion control agent (C), photoacid generator (B), and resin (A) in specific ratios, where the synergistic interaction between these components enables both high multibeam exposure sensitivity and excellent LWR performance
2Manufacturing precision
If exposure dose is increased to achieve target line width roughness (LWR) performance, then LWR performance is improved, but electron beam exposure time further increases
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by increasing acid diffusion control agent content to 5-50 mass% and setting the molar ratio (Qp) to 0.3 or greater, which enables achieving target LWR performance at lower exposure doses, thereby reducing exposure time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively improves LWR performance and resolution in high exposure amount ranges, thereby enhancing the productivity of photo mask manufacturing and reducing electron beam exposure time.
Implementation Method 1
a step of coating a substrate with an actinic ray-sensitive or radiation-sensitive resin composition which contains a resin (A), a photoacid generator (B), and an acid diffusion control agent (C)
Implementation Method 2
an acid diffusion control agent (C) in which a molar ratio (Qp) between the photoacid generator (B) and the acid diffusion control agent (C)
Implementation Method 3
a step of simultaneously irradiating the actinic ray-sensitive film with a plurality of electron beams
Data Source
AI summary
A pattern forming method including a step of coating a substrate with an actinic ray-sensitive or radiation-sensitive resin composition and forming an actinic ray-sensitive or radiation-sensitive film; a step of simultaneously irradiating the actinic ray-sensitive or radiation-sensitive film with a plurality of electron beams; and a step of developing the actinic ray-sensitive or radiation-sensitive film after the irradiation with electron beams is provided. The composition contains a resin (A), a photoacid generator (B), and an acid diffusion control agent (C) and a molar ratio (Qp) between the photoacid generator (B) and the acid diffusion control agent (C), which is represented by Equation (1) is 0.3 or greater.Qp (molar ratio)=Acid diffusion control agent (C)/Photoacid generator (B) (1)