Chemically Amplified Resist Polymer for Lithography Sensitivity
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Solution Overview
Problem
Current chemically amplified resist compositions for semiconductor microfabrication face challenges in achieving high resolution and good pattern profile, particularly in sensitivity and heat resistance, despite advancements in resin structures and acid generators.
Innovation Solution
A novel polymer with specific structural units, including acid-labile groups and alicyclic hydrocarbon groups, is developed, combined with an acid generator to enhance the chemically amplified resist composition's sensitivity and heat resistance, and improve line width roughness and adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin structures and acid generators are used in chemically amplified resist compositions, then the basic resist function is maintained, but sensitivity and heat resistance are insufficient for high resolution patterning
Solution Approach 1:
The patent employs composite polymer structures combining multiple functional units: adamantane-derived acid-labile groups for sensitivity enhancement, alicyclic hydrocarbon groups for heat resistance and mechanical strength, and carboxyl-containing groups for adhesion control. This composite approach allows simultaneous optimization of sensitivity and thermal properties that cannot be achieved with conventional single-structure resins.
Solution Approach 2:
The resist polymer is designed with specific local structural characteristics: adamantane groups positioned to provide acid-labile functionality for sensitivity, alicyclic groups distributed to enhance heat resistance and line width control, and carboxyl groups strategically placed to control adhesion and pattern profile. Each local region of the polymer chain contributes specific properties to resolve the contradiction.
2Measurement precision
If polymer structures are optimized for sensitivity, then acid-labile groups enhance detection, but heat resistance and line width roughness deteriorate
Solution Approach 1:
The polymer is segmented into distinct functional units with specific roles: adamantane-derived acid-labile groups (20-80 mol%) for sensitivity and acid generation, alicyclic hydrocarbon groups (10-60 mol%) for heat resistance and mechanical stability, and carboxyl-containing groups (5-30 mol%) for adhesion control. This segmentation allows each component to optimize its function without compromising overall performance.
Solution Approach 2:
The patent systematically varies the molar ratios of different structural units to optimize the balance between sensitivity and heat resistance. By adjusting the content of acid-labile groups versus thermally stable alicyclic groups, the composition achieves optimal sensitivity while maintaining sufficient heat resistance for high resolution patterning processes.
3Measurement precision
If acid-labile groups are increased to improve sensitivity, then pattern detection enhances, but pattern profile and adhesiveness deteriorate
Solution Approach 1:
The patent optimizes the molar ratio of acid-labile groups to alicyclic groups and carboxyl groups to achieve the desired pattern profile. By controlling the concentration of acid-labile groups within 20-80 mol% and balancing with thermally stable and adhesive groups, the composition achieves high sensitivity while maintaining good pattern profile and adhesiveness.
Solution Approach 2:
The resist composition uses a composite polymer system where adamantane-derived acid-labile groups provide sensitivity, alicyclic hydrocarbon groups maintain pattern profile and mechanical strength, and carboxyl-containing groups control adhesion. This composite structure resolves the contradiction between sensitivity enhancement and pattern profile maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The novel polymer composition achieves improved sensitivity, heat resistance, and line width roughness, making it suitable for advanced lithography techniques like ArF excimer laser lithography, KrF excimer laser lithography, and ArF immersion lithography.
Implementation Method 1
a chemically amplified resist composition used for semiconductor microfabrication employing a lithography process contains an acid generator comprising a compound generating an acid by irradiation
Data Source
AI summary
A polymer comprising a structural unit represented by the formula (Ia) or (Ib):wherein R1 represents a hydrogen atom etc., R2 represents a linear, branched chain or cyclic C1-C8 alkyl group, R3 represents a methyl group, n represents an integer of 0 to 14, Z1 represents a single bond etc., k represents an integer of 1 to 4, R4 and R5 each independently represents a hydrogen atom etc., and m represents an integer of 1 to 3, a structural unit represented by the formula (II):wherein R6 and R7 each independently represents a hydrogen atom etc., R8 represents a methyl group, R9 represents a hydrogen atom etc., n′ represents an integer of 0 to 12, Z2 represents a single bond etc., k′ represents an integer of 1 to 4, R21 and R22 each independently represents a hydrogen atom etc., and R23 represents a C1-C30 monovalent hydrocarbon group, andat least one structural unit selected from the group consisting of structural units represented by the formulae (IIIa), (IIIb), (IIIc), (IIId) and (IIIf)wherein R10 represents a hydrogen atom etc., R11 represents a methyl group, R12 is independently in each occurrence a carboxyl group etc., j represents an integer of 0 to 3, a represents an integer of 0 to 5, b represents an integer of 0 to 3, c represents an integer of 0 to (2j+2), Z3 represents a single bond etc., and k″ represents an integer of 1 to 4.