Resist Pattern Rinse Composition to Prevent Collapse and Bridging
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Solution Overview
Problem
Current electronic device manufacturing processes face challenges such as defects, bridge formation, resist pattern collapse, width non-uniformity, residue after solution removal, high surface tension, environmental impact, handling risks, and storage stability issues in fine resist patterns.
Innovation Solution
An electronic device manufacturing solution comprising an anionic surfactant, a solvent, and a quaternary ammonium compound is used, which includes applying a photosensitive resin composition on a substrate, exposing it to radiation, developing the layer, and cleaning with the solution to reduce defects and prevent pattern collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light with short wavelength is used for exposure to form finer patterns, then resolution is improved, but pattern collapse and yield decrease occur
Solution Approach 1:
The patent changes the chemical composition parameters of the rinse liquid by incorporating specific surfactants (anionic, cationic, amphoteric, or nonionic) with optimized HLB values and concentrations. This modifies the surface tension and wetting properties of the rinse liquid, enabling it to effectively remove developer residues without causing pattern collapse, thus maintaining both high resolution and pattern stability
Solution Approach 2:
The patent uses composite surfactant systems combining multiple types of surfactants (anionic, cationic, amphoteric, nonionic) in specific ratios. This composite approach creates synergistic effects that optimize both the cleaning performance for high-resolution patterns and the protective effect against pattern collapse, resolving the contradiction between resolution and stability
2Ease of manufacture
If conventional surfactant-containing rinse liquid is used, then cleaning performance is maintained, but environmental impact and handling risk increase
Solution Approach 1:
The patent modifies the chemical parameters of the rinse liquid by selecting surfactants with specific molecular structures and properties (HLB values, chain lengths) that provide effective cleaning performance while having lower environmental toxicity and biodegradability, thus reducing harmful factors while maintaining cleaning efficacy
Solution Approach 2:
The patent employs surfactants that can be effectively removed after use, allowing the rinse liquid to perform its cleaning function and then be discarded or treated without long-term environmental persistence, reducing the cumulative environmental impact while maintaining cleaning performance
3Manufacturing precision
If fine resist patterns are formed, then resolution is improved, but defects and bridge formation increase
Solution Approach 1:
The patent optimizes the chemical parameters of the rinse liquid including surfactant concentration, HLB value, and molecular structure to achieve optimal wetting and capillary action. This enables complete removal of developer residues from fine pattern spaces without causing pattern collapse or bridge formation, reducing defects while maintaining high resolution
Solution Approach 2:
The surfactant acts as an intermediary substance that mediates between the rinse liquid and the fine resist pattern. It reduces surface tension and improves wetting, allowing the rinse liquid to effectively remove residues from narrow spaces without directly attacking or damaging the fine patterns, thus preventing bridge formation and defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces defects, suppresses bridge formation, prevents resist pattern collapse, achieves uniformity, decreases surface tension, minimizes environmental impact, reduces handling risks, and enhances storage stability of the manufacturing solution.
Implementation Method 1
a quaternary ammonium compound (C)... It is possible to reduce the surface tension of an electronic device manufacturing solution
Implementation Method 2
anionic surfactant (A)... quaternary ammonium compound (C)... prevent the resist pattern collapse in fine resist patterns
Implementation Method 3
exposing the photosensitive resin layer to radiation... (2) exposing the photosensitive resin layer to radiation
Data Source
AI summary
Provided are an electronic device manufacturing solution, a method for manufacturing a resist pattern, and a method for manufacturing a device.