Positive Resist Composition Sensitizer Architecture for Lithography Resolution
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Solution Overview
Problem
Conventional sensitizers used in chemically amplified resist compositions for lithography techniques have inadequate sensitivity-enhancing effects and deteriorate resolution, failing to improve dissolution contrast between unexposed and exposed portions, which is crucial for lithography properties.
Innovation Solution
A positive resist composition incorporating a base component that becomes soluble in an alkali developing solution under acid action, combined with a sensitizer featuring a polymeric compound with a hydrocarbon or heterocycle core and arm portions, and an acid generator component to enhance sensitivity and lithography properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sensitizers are used in chemically amplified resist compositions, then sensitivity enhancement is attempted, but resolution deteriorates and dissolution contrast is not improved
Solution Approach 1:
The patent changes the chemical parameters of the sensitizer by using a polymeric compound with specific functional groups (carboxyl, hydroxyl, or amine groups) that can interact with the base resin. This parameter change enables the sensitizer to improve both sensitivity and dissolution contrast without sacrificing resolution, as the polymeric structure allows for controlled chemical interactions that enhance lithography properties.
Solution Approach 2:
The patent employs a composite sensitizer system combining a polymeric compound with specific functional groups and a base resin containing acid-generating groups. This composite approach creates synergistic effects where the polymeric sensitizer enhances sensitivity while the base resin provides acid generation for solubility changes, achieving improved resolution and dissolution contrast simultaneously.
2Reliability
If conventional sensitizers are used to enhance sensitivity, then sensitivity improves slightly, but dissolution contrast between exposed and unexposed portions is not improved
Solution Approach 1:
The patent modifies the sensitizer's chemical parameters by incorporating polymeric compounds with specific functional groups (carboxyl, hydroxyl, amine) that can form hydrogen bonds or ionic interactions with the base resin. This parameter change enables the sensitizer to simultaneously enhance sensitivity and improve dissolution contrast, as the polymeric structure facilitates controlled solubility changes in exposed versus unexposed regions.
3Reliability
If existing resist compositions are used, then basic lithography function is maintained, but line edge roughness increases
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by introducing a polymeric sensitizer with specific functional groups that interact with the base resin. This parameter change improves line edge roughness by enhancing the uniformity of acid generation and solubility changes, leading to smoother line edges while maintaining basic lithography function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves improved sensitivity and lithography properties, including enhanced resolution, exposure latitude, and reduced line edge roughness, by effectively increasing solubility in alkali developing solutions and maintaining unexposed portion insolubility.
Implementation Method 1
an acid generator that generates acid upon exposure
Implementation Method 2
a base component (A) that exhibits increased solubility in an alkali developing solution under the action of acid
Data Source
AI summary
A positive resist composition including:a base component; anda sensitizer which a polymeric compound having a core portion that includes a hydrocarbon group or a heterocycle of two or more valences and at least one arm portion bonded to the core portion and represented by formula (1), and a polymeric compound having a core portion including a polymer having a molecular weight of 500 to 20,000 and at least one arm portion bonded to the core portion and represented by formula (1); and either the base component includes a resin component that generates acid upon exposure and exhibits increased solubility in an alkali developing solution under action of acid, or the positive resist composition further contains an acid generator component including a compound that generates acid upon exposure:—(X)—Y (1)in which X represents a divalent linking group having an acid dissociable group; and Y represents a polymer chain.