Resist Pattern Thickening Composition for EUV Etch Durability

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Solution Overview

Problem

Existing methods for manufacturing resist patterns, particularly in EUV exposure, fail to provide sufficient durability as an etching mask, leading to potential etching of masked objects, and struggle with thickening fine patterns, etching resistance, resolution, and process window limitations.

Innovation Solution

A thickening composition comprising a polymer with specific repeating units and a solvent is applied to form a thickening layer on a resist layer, followed by development, to enhance the resist pattern's thickness and etching resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional resist pattern is used in EUV exposure, then the resolution is achieved, but the durability as an etching mask is insufficient

Engineering Contradiction:

Improvedurability as etching maskVSAvoidpattern thickness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

A thickening layer is formed on the resist pattern before the etching process. This preliminary action of thickening ensures that the resist pattern has sufficient durability to withstand the etching process while maintaining the original fine pattern dimensions and resolution.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses a composite structure consisting of a resist layer and a thickening layer. The thickening layer is formed by applying a composition containing a polymer and a solvent, creating a composite material that combines the high-resolution properties of the resist with the mechanical durability of the thickening layer.

Inventive Principle:

Principle #40Composite materials

2Reliability

If the resist pattern is thickened to improve etching resistance, then the durability is improved, but the resolution and pattern uniformity deteriorate

Engineering Contradiction:

Improveetching resistanceVSAvoidpattern uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The thickening layer is applied locally on top of the resist pattern rather than replacing the entire pattern. This local quality approach allows the bottom resist layer to maintain fine pattern definition while the upper thickening layer provides additional etching resistance, achieving both goals simultaneously.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Instead of increasing pattern thickness in the vertical dimension alone, the patent adds a separate thickening layer dimension. This dimensional approach allows independent optimization: the resist layer maintains thin profile for resolution while the added thickening layer provides mechanical durability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Length of stationary object

If a polymer composition is applied to thicken the resist pattern, then the thickness is increased, but the exposed part cannot be sufficiently dissolved in the developer

Engineering Contradiction:

Improveresist pattern thicknessVSAvoiddevelopment process efficiency

Core Design Contradiction:

Length of stationary objectVSEase of manufacture

Solution Approach 1:

The patent carefully selects and adjusts the composition parameters of the thickening layer, including polymer type, molecular weight, and solvent content. These parameter changes ensure that the thickening layer has appropriate solubility characteristics - thick enough for durability but still capable of being sufficiently dissolved in the developer where required.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The solvent in the thickening composition acts as an intermediary that facilitates controlled dissolution. It allows the thickening layer to be applied in a stable form and then progressively dissolved in the developer, enabling the development process to penetrate and dissolve the exposed parts effectively despite the increased thickness.

Inventive Principle:

Principle #24Intermediary (Mediator)

4Manufacturing precision

If the resist pattern is made thinner to improve resolution, then the manufacturing precision is improved, but the etching resistance deteriorates

Engineering Contradiction:

ImproveresolutionVSAvoidetching resistance

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent segments the resist pattern into two functional parts: a thin resist layer for high-resolution patterning and a separate thickening layer for etching resistance. This segmentation allows each layer to be optimized independently - the resist layer remains thin for resolution while the thickening layer provides the necessary mechanical protection during etching.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20260016752A1Thickening composition, method for manufacturing thickened resist pattern, and method for manufacturing processed substrate

Publication Date: 2026.01.15 MERCK PATENT GMBH

AI summary

A thickening composition includes a polymer (A) comprising a repeating unit (A1) represented by the formula (a1) and a solvent (B), all of which are defined herein.