Resist Underlayer Film Composition for Etching and Heat Resistance

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Solution Overview

Problem

Existing resist underlayer films face challenges in providing adequate etching resistance, heat resistance, and embedding properties, especially when forming patterns on substrates with varying trench aspect ratios.

Innovation Solution

A composition comprising a compound with an aromatic hydrocarbon ring structure and a partial structure bonded to it, along with a solvent, is used to form a resist underlayer film, enhancing etching resistance, heat resistance, and embedding properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional resist underlayer films are used, then the basic film formation is achieved, but the etching resistance, heat resistance, and embedding properties are insufficient

Engineering Contradiction:

Improveetching resistanceVSAvoidfilm formation process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the chemical composition parameters of the resist underlayer film by incorporating specific compounds with aromatic hydrocarbon ring structures (25 or more carbon atoms) and particular partial structures (formulas i-iv). This compositional parameter change enhances etching resistance while maintaining manufacturability through conventional coating and heating processes.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite resist underlayer film by combining organic compounds with specific molecular structures. The composite nature of the material, featuring aromatic hydrocarbon cores with specific partial structures, provides superior etching resistance and heat resistance compared to conventional single-material underlayer films.

Inventive Principle:

Principle #40Composite materials

2Temperature

If conventional resist underlayer films are used, then the basic film formation is achieved, but the heat resistance is insufficient

Engineering Contradiction:

Improveheat resistanceVSAvoidfilm formation process

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the thermal stability parameters by selecting compounds with high carbon atom counts (25 or more in aromatic hydrocarbon rings) and specific stable partial structures. These structural parameters inherently provide heat resistance while allowing formation through standard manufacturing processes.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If conventional resist underlayer films are used, then the basic film formation is achieved, but the embedding properties are insufficient

Engineering Contradiction:

Improveembedding propertiesVSAvoidfilm formation process

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent optimizes the molecular structure parameters of the resist underlayer film components. The specific compound structures (aromatic hydrocarbon rings with 25+ carbon atoms and defined partial structures) provide appropriate viscosity and flow characteristics that enable excellent embedding into substrate trenches while maintaining ease of manufacture through conventional application methods.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS12517433B2Composition, resist underlayer film, method of forming film, method of producing patterned substrate, and compound

Publication Date: 2026.01.06 JSR CORPORATION

AI summary

A composition includes: a compound including an aromatic hydrocarbon ring structure, and a partial structure represented by formula (1) which bonds to the aromatic hydrocarbon ring structure; and a solvent. The aromatic hydrocarbon ring structure has no fewer than 25 carbon atoms. In the formula (1), X represents a group represented by formula (i), (ii), (iii), or (iv); and *'s denote binding sites to two adjacent carbon atoms constituting the aromatic hydrocarbon ring structure. A method of producing a patterned substrate, includes applying the composition directly or indirectly on a substrate to form a resist underlayer film; forming a resist pattern directly or indirectly on the resist underlayer film; and carrying out etching using the resist pattern as a mask.