Resist Underlayer Composition for Solvent Resistance and EUV Sensitivity
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Solution Overview
Problem
Existing resist underlayer films face issues with intermixing with resist films and low sensitivity, particularly in advanced lithography processes using EUV light and electron beams.
Innovation Solution
A resist underlayer film-forming composition comprising a hydroxy group-containing polymer, a photoacid generator with a hydroxy group in its cationic part, and a crosslinking agent that reacts with hydroxy groups, enhancing solvent resistance and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional resist underlayer film is used, then the substrate is protected, but the film shows intermixing with the resist film and low sensitivity
Solution Approach 1:
The patent uses a composite material system consisting of a polymer with hydroxy groups, a photoacid generator, and a crosslinking agent. This composite formulation creates a resist underlayer film that simultaneously achieves high solvent resistance through crosslinking and high sensitivity through the photoacid generator's ability to rapidly generate acid upon exposure, resolving the contradiction between reliability and manufacturing precision
Solution Approach 2:
The patent changes the chemical parameters of the underlayer film by introducing specific functional groups (hydroxy groups that react with crosslinking agents) and optimizing the photoacid generator concentration. These parameter changes enable the film to achieve both high solvent resistance and high sensitivity, allowing precise pattern formation while maintaining film integrity
2Stability of the object's composition
If the solvent resistance of the underlayer film is increased, then intermixing with resist film is prevented, but the sensitivity of the resist film decreases
Solution Approach 1:
The patent introduces a crosslinking agent as an intermediary that reacts with hydroxy groups on the polymer chains to form a crosslinked network. This crosslinked structure provides solvent resistance as a mediator property, while the photoacid generator simultaneously provides sensitivity through acid generation upon exposure, allowing both properties to coexist without compromising either
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables improved solvent resistance and enhances sensitivity of the resist film, suitable for semiconductor processing.
Implementation Method 1
a photoacid generator (B) containing a hydroxy group in a cationic part
Implementation Method 2
a crosslinking agent (C) that can react with a hydroxy group
Data Source
AI summary
A resist underlayer film-forming composition for EB or EUV lithography, the resist underlayer film-forming composition including: a hydroxy group-containing polymer; a photoacid generator containing a hydroxy group in a cationic part; a crosslinking agent that can react with a hydroxy group; and a solvent.


