Resist Underlayer Composition for Heat-Reflow Pattern Filling
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Solution Overview
Problem
Thermosetting resist underlayer film-forming compositions used in semiconductor manufacturing face challenges in maintaining pattern filling ability and film flatness due to increased viscosity during baking, leading to deteriorated flatness and adhesion issues.
Innovation Solution
A resist underlayer film-forming composition incorporating specific compounds of Formula (A) and/or Formula (B) along with a solvent, which enhances heat-reflowability and includes a crosslinking agent, acid, or acid generating agent to improve the film's heat resistance and flatness on substrates with steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermosetting resist underlayer film-forming composition is used to prevent mixing when photoresist compositions are laminated, then adhesion and pattern definition are improved, but viscosity increases as cross-linking reaction proceeds during baking, causing deterioration in pattern filling ability and film flatness
Solution Approach 1:
The patent changes the chemical structure parameters of the polymer resin by introducing specific functional groups (carboxyl, hydroxyl, or amine groups) that enable heat-reflowability. This allows the composition to maintain cross-linking for adhesion while gaining the ability to flow and refill patterns during baking, thus resolving the contradiction between improved adhesion and maintained film flatness
Solution Approach 2:
The patent introduces dynamic heat-reflowability to the thermosetting composition, allowing it to transition from a rigid cross-linked structure to a mobile state during baking. This dynamic property enables the composition to automatically refill patterns and maintain flatness while still achieving strong adhesion through cross-linking
2Strength
If baking temperature is increased to improve cross-linking and adhesion, then pattern definition and etching resistance are enhanced, but film flatness deteriorates due to increased viscosity and reduced heat-reflowability
Solution Approach 1:
The patent changes the thermal parameters of the composition by incorporating polymers with specific functional groups that exhibit heat-reflowability. This allows the composition to maintain strength and etching resistance through cross-linking while retaining the ability to flow at baking temperatures, thus resolving the contradiction between enhanced etching resistance and maintained film flatness
3Reliability
If cross-linking agents and acid catalysts are added to improve adhesion and prevent mixing, then pattern definition is improved, but viscosity increases during baking causing deterioration in pattern filling ability
Solution Approach 1:
The patent changes the molecular parameters of the polymer resin by introducing functional groups that provide heat-reflowability. This allows the composition to maintain good pattern definition through cross-linking while gaining the ability to flow and fill patterns during baking, thus resolving the contradiction between improved pattern definition and maintained pattern filling ability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high etching resistance, favorable dry etching rates, and maintains film flatness even on substrates with steps, effectively addressing the limitations of existing thermosetting compositions by improving heat-reflowability and adhesion.
Implementation Method 1
the coating film is thermally cured by introducing a self-crosslinking part into a polymer resin which is a main component or by appropriately adding a crosslinking agent, a crosslinking catalyst or the like, and baking at a high temperature
Data Source
AI summary
A resist underlayer film-forming composition improves an ability to fill patterns during baking by improving heat-reflowability of a polymer; a resist underlayer film being a baked product of a coating film formed from the resist underlayer film-forming composition; and a method for producing a semiconductor device includes a step of forming the resist underlayer film. The resist underlayer film-forming composition includes a compound of the following formula (A) or (B) and a solvent.