Resist Underlayer Composition for Low-Sublimate Fine Pattern Filling
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Solution Overview
Problem
The generation of sublimate contaminants during the semiconductor device production process due to the use of conventional resist underlayer film-forming compositions, which leads to defects and contamination of film formation apparatus, is a significant challenge.
Innovation Solution
A resist underlayer film-forming composition containing a crosslinkable compound with substituted C2-10 long chain alkyl or C2-10 alkyl groups with C1-10 alkoxy groups is used, which reduces sublimate generation and enhances embeddability, thereby minimizing coating defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resist underlayer film-forming composition is used, then the film can be formed for lithography process, but sublimate contaminants are generated during baking process
Solution Approach 1:
The patent modifies the chemical structure of the crosslinkable compound by introducing specific alkyl groups with particular carbon chain lengths (C2-10) and alkoxy groups (C1-10), thereby changing the physical and chemical parameters of the composition to reduce sublimate generation while maintaining film formation reliability
Solution Approach 2:
The patent uses a composite material system consisting of resin, specifically designed crosslinkable compounds with substituted alkyl and alkoxy groups, and crosslinking catalyst, where the synergistic interaction between components reduces sublimate generation during baking while ensuring proper crosslinking and film formation
2Reliability
If crosslinkable compound and catalyst are added to form thermally curable film, then adhesion and resolution are improved, but sublimate generation increases
Solution Approach 1:
The patent introduces specific local chemical structures (C2-10 alkyl groups and C1-10 alkoxy groups) at particular positions within the crosslinkable compound molecules, creating local regions with optimized properties that reduce sublimate generation while maintaining the overall crosslinking functionality for adhesion and resolution
Solution Approach 2:
The patent optimizes the molecular weight, functional group composition, and structural parameters of the crosslinkable compound to achieve a balance between crosslinking reactivity (for adhesion and resolution) and sublimate generation reduction, specifically using compounds with controlled carbon chain lengths and alkoxy substitutions
3Productivity
If conventional crosslinking agents are used, then crosslinking reaction proceeds efficiently, but coating defects occur due to poor embeddability
Solution Approach 1:
The patent modifies the viscosity, molecular weight, and functional group density parameters of the crosslinkable compound to optimize both crosslinking efficiency and embeddability, ensuring the composition can properly fill fine hole patterns without defects while maintaining rapid crosslinking response
Solution Approach 2:
The patent designs the crosslinkable compound structure in advance to possess inherent flow and embedding properties that enable proper filling of substrate features before crosslinking occurs, ensuring defect-free coating formation followed by efficient crosslinking
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces sublimate formation, ensuring better adhesion and filling of fine hole patterns without clearance gaps, thus improving the quality and reliability of semiconductor devices.
Implementation Method 1
a crosslinkable compound of Formula (1) or Formula (2)... a resin and a crosslinkable compound... to form a thermally curable crosslinking film
Data Source
AI summary
A resist underlayer film-forming composition includes a resin; and a crosslinkable compound of Formula (1) or Formula (2):wherein the crosslinkable compound of Formula (1) or Formula (2) is a compound obtained by reacting a compound of Formula (3) or Formula (4):with an ether compound comprising a hydroxy group or a C2-10 alcohol.