Resist Underlayer Composition for Low-Temperature Self-Curing Films
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Solution Overview
Problem
Conventional resist underlayer film-forming compositions are unsatisfactory as they cannot be self-cured at low temperatures without acid catalysts or crosslinking agents, generate sublimates that contaminate apparatuses, and fail to form high-hardness films with high bend resistance.
Innovation Solution
A resist underlayer film-forming composition comprising a solvent and a polymer with specific repeating structural units, allowing self-curing at low temperatures without acid catalysts or crosslinking agents, reducing sublimate generation, and enabling the formation of high-hardness films with high bend resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional resist underlayer film-forming compositions are used, then the film can be formed, but self-curing at low temperature without acid catalyst or crosslinking agent is not achieved
Solution Approach 1:
The invention changes the chemical parameters of the polymer by introducing specific structural units with ROCH2- groups that can undergo spontaneous condensation reactions at low temperatures without requiring acid catalysts or crosslinking agents, thereby achieving self-curing at reduced temperatures
Solution Approach 2:
The polymer composition is designed to perform self-curing through its inherent chemical structure, where the ROCH2- groups automatically condense to form crosslinked networks without external catalysts, making the system self-sufficient and eliminating the need for additional chemical additives
2Strength
If conventional resist underlayer film-forming compositions are used, then the film can be formed, but high hardness and high bend resistance are not achieved
Solution Approach 1:
The invention creates a composite polymer structure by combining specific aromatic compounds (A and B) with ROCH2- groups in defined ratios, forming a crosslinked network that achieves high hardness and bend resistance through the synergistic interaction of different structural units without requiring complex multi-component compositions
3Object-generated harmful factors
If conventional resist underlayer film-forming compositions are used, then the film can be formed, but sublimate generation contaminating apparatuses occurs
Solution Approach 1:
The invention converts the potential harm of sublimate generation into a benefit by designing a polymer composition that cures at low temperatures through spontaneous condensation, reducing the thermal energy available for sublimation while maintaining effective crosslinking, thereby minimizing apparatus contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves self-curing at low temperatures, reduces sublimate generation, and forms high-hardness films with improved bend resistance, while maintaining optical constants and etching resistance.
Implementation Method 1
a polymer (X) comprising a repeating structural unit, in which an aromatic compound A having an ROCH2— group (R is a monovalent organic group, a hydrogen atom, or a mixture thereof) and a C120 or lower aromatic compound B different from the compound A are alternately bonded to each other via a linking group —O—
Data Source
AI summary
A resist underlayer film-forming composition: in which self-curing is performed at a low temperature without an acid catalyst or a crosslinking agent, the amount of a sublimate can be reduced, and a high-hardness film having high bending resistance; suitable as a crosslinking agent; exhibits higher flattening and heat resistance when used as a crosslinking agent; has embedding properties equivalent to conventional products; and has an optical constant or etching resistance freely changeable according to monomer selection. The composition contains a solvent and a polymer (X) containing a repeating structural unit which is obtained by alternately bonding, via a linking group —O—, an aromatic compound A having an ROCH2— group (R is a monovalent organic group, a hydrogen atom, or a mixture thereof) to an aromatic compound B having at most 120 carbon atoms and different from A, and in which one to six B's are bonded to one A.