Resist Underlayer Composition for Stable Low-Temperature Crosslinking
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Solution Overview
Problem
Existing resist underlayer film-forming compositions experience degeneration of crosslinking agents due to reactions with solvents, leading to decreased film curability and increased sublimates, especially when using aminoplast or phenoplast crosslinking agents.
Innovation Solution
A resist underlayer film-forming composition incorporating a crosslinkable resin, a crosslinking agent, and a crosslinking catalyst represented by formula (I), along with specific solvents and optional additives, to inhibit side reactions and enhance storage stability and reduce sublimates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional thermal acid generators with strong bases or high boiling points are used, then crosslinking reaction activity is improved, but curability of the underlying film decreases and sublimates increase
Solution Approach 1:
The patent changes the pKa parameter of the base component from conventional high values (>10) to a specific range (6.5-9.5), and adjusts the molecular weight of the sulfonic acid component to 50-500. This parameter optimization enables the crosslinking catalyst to achieve sufficient reaction activity while maintaining proper curability and reducing sublimates, resolving the contradiction between reaction power and film reliability
2Speed
If conventional crosslinking catalysts are used, then crosslinking speed is improved, but degeneration of crosslinking agent increases due to side reactions with solvents
Solution Approach 1:
The patent introduces a specifically designed crosslinking catalyst as an intermediary substance that mediates the crosslinking reaction. This catalyst, with its optimized base and sulfonic acid components, enables the crosslinking agent to react with the resin without undergoing harmful side reactions with solvents like propylene glycol monomethyl ether, thus maintaining both crosslinking speed and agent stability
3Power
If conventional crosslinking catalysts are used, then crosslinking efficiency is improved, but leaching into photoresist solvents occurs
Solution Approach 1:
The patent optimizes the molecular weight parameter of the sulfonic acid component (50-500) and the pKa of the base (6.5-9.5), which controls the catalyst's reactivity and byproduct formation. This parameter optimization ensures high crosslinking efficiency while minimizing leaching into photoresist solvents, as the controlled reaction produces fewer soluble byproducts that could cause leaching
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high storage stability, low curing start temperature, and minimal leaching into photoresist solvents, forming a durable film suitable for semiconductor manufacturing.
Implementation Method 1
a crosslinking catalyst represented by the following formula (I): (A-SO3)−(BH)+ wherein A is a linear, branched, or cyclic saturated or unsaturated aliphatic hydrocarbon group which may be substituted, an aryl group which may be substituted with one or more groups other than hydroxy group, or a heteroaryl group which may be substituted, and B is a base having a pKa of 6.5 to 9.5
Data Source
AI summary
A resist underlayer film forming composition which has high storage stability, has a low film curing start temperature, can cause the generation of a sublimated product in a reduced amount, and enables the formation of a film that is rarely eluted into a photoresist solvent; a method for forming a resist pattern using the resist underlayer film forming composition; and a method for manufacturing a semiconductor device. The resist underlayer film forming composition includes a crosslinkable resin, a crosslinking agent, a crosslinking catalyst represented by formula (I) and a solvent. (A-SO3)−(BH)+[wherein A represents a linear, branched or cyclic saturated or unsaturated aliphatic hydrocarbon group which may be substituted, an aryl group which may be substituted by a group other than a hydroxy group, or a heteroaryl group which may be substituted; and B represents a base having a pKa value of 6.5 to 9.5.]