Resistance Heater With Recessed Cross-Sectional Shape
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Solution Overview
Problem
Prior art resistance heaters used in semiconductor wafer processing have low electric resistance, leading to high costs and deformation at high temperatures, and expanded terminal end portions complicate heat pattern design and uniform heating.
Innovation Solution
A resistance heater with a body having a smooth, flat heating surface and a recessed cross-sectional shape, such as U, I, or H-shape, to increase electric resistance and prevent deformation, while maintaining a narrow terminal end portion for controlled heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heater uses low electric resistance material to reduce power source cost, then the power source cost decreases, but the heater deforms at high temperatures and cannot uniformly heat the wafer
Solution Approach 1:
The patent changes the electric resistance parameter of the heating element from low resistance to high resistance, which allows the use of standard voltage power sources instead of expensive high-current power sources, while also improving high-temperature stability and uniform heating capability
2Reliability
If the terminal end portions are expanded to decrease electric resistance and prevent overheating, then overheating is prevented, but heat pattern design becomes more difficult
Solution Approach 1:
The patent applies local quality by making the terminal end portions narrower than the central portion, creating a localized structural difference that controls heat distribution. This narrow terminal design prevents excessive heat generation at the ends while maintaining simple, versatile heat pattern design capability for the central heating area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved electric resistance, prevents deformation at high temperatures, and allows for more versatile heat pattern design with uniform heating of semiconductor wafers.
Implementation Method 1
applying an electric current to the heater, and heating the semiconductor wafer to a predetermined temperature
Data Source
AI summary
A resistance heater is shown and described. The resistance heater may include a body. The body may include at least one heating surface, the heating surface being generally smooth and generally flat and a recess formed in the body, at least a portion of the body having a cross-sectional shape selected from the group consisting of: generally U shape, generally I-shape, and generally H-shape, and where the cross-sectional shape extends along at least a portion of the body.


