Resistance Soldering Voltage Detection for Accurate Solder Placement
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Solution Overview
Problem
In resistance soldering methods for producing electrical machine windings, accurate positioning of the solder element between copper plates is critical, but existing automatic detection methods are complex and costly, leading to defective soldering points and increased rejection rates.
Innovation Solution
A control unit in the resistance soldering method detects the correct or incorrect position of the solder element by determining voltages between the solder element and points in the electric circuit, comparing these voltages with saved values to establish the correct position, thereby ensuring proper soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical detection by CCD camera is used to detect solder element position, then detection capability is improved, but device complexity and costs increase significantly
Solution Approach 1:
The patent replaces the optical CCD camera detection system with an electrical resistance-based detection system. Instead of using complex optical components to detect solder element position, the invention measures electrical resistance values at different points in the circuit, which change based on solder element position. This substitution of mechanical/optical detection with electrical measurement significantly reduces device complexity while maintaining detection capability.
Solution Approach 2:
The patent introduces electrical resistance as an intermediary parameter to detect solder element position. Rather than directly observing the physical position with a camera, the system measures resistance values that indirectly indicate position. This intermediary approach simplifies the detection system by using easily measurable electrical properties instead of complex optical imaging.
2Productivity
If automatic positioning of solder element is used, then productivity is improved, but manufacturing precision deteriorates due to incorrect positioning
Solution Approach 1:
The patent implements a feedback mechanism where the control unit continuously monitors electrical resistance values during the soldering process. Based on these resistance measurements, the system can detect deviations in solder element position and provide feedback to adjust the positioning or identify defective soldering points. This feedback loop maintains manufacturing precision while preserving the benefits of automatic positioning.
Solution Approach 2:
The patent performs preliminary detection of solder element position by measuring electrical resistance before completing the soldering process. This preliminary action allows the system to identify positioning issues early, preventing defective soldering points from being created in the first place, thereby maintaining precision in automated production.
3Manufacturing precision
If subsequent controls are implemented to detect defective windings, then manufacturing precision is improved, but productivity decreases due to additional processing time
Solution Approach 1:
The patent performs defect detection as a preliminary action during the soldering process itself, rather than as a subsequent separate control step. By measuring electrical resistance values in real-time and comparing them against expected values, the system identifies defective soldering points before the winding process completes. This eliminates the need for additional post-processing inspection steps, maintaining both precision and productivity.
Solution Approach 2:
The patent merges the defect detection function with the soldering process by integrating resistance measurement capabilities into the soldering device. Instead of having separate inspection equipment and processes, the detection and soldering operations are combined into a single integrated system, eliminating redundant steps and maintaining production speed while ensuring quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and secures the detection of the solder element's position, preventing defective soldering points and reducing the number of rejected components by accurately determining the correct placement of the solder element.
Implementation Method 1
As a result of the heat generated by the application of the voltage to the solder element, the latter melts and connects the two copper plates in a materially bonded manner
Implementation Method 2
the two electrodes of the soldering device, the two basic elements and the solder element each have a determinable electrical resistance such that, in the resistance soldering method, upon the application of the output voltage to the plate assembly, a series circuit and consequently a voltage divider are constituted
Data Source
AI summary
The present disclosure describes a resistance soldering method for producing a plate assembly including at least two basic elements that are materially bonded together via a soldering device, e.g., for producing a winding of an electrical machine. The method includes applying an output voltage to a first electrode and a second electrode, between which the at least two basic elements are arranged, to solder a solder element interposed therebetween; detecting a correct or incorrect position of the solder element in the plate assembly via a control unit; determining via the control unit a voltage between the solder element and one or more points on the electric circuit. The control unit detects the correct or incorrect position of the solder element through an evaluation and/or a comparison with reference to the voltage or voltages.