Resistive Annulus Shield Connector for EMI Bond-Degradation Testing
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Solution Overview
Problem
Existing electrical control systems, particularly those used in aircraft, do not effectively test for electromagnetic interference (EMI) susceptibility and emission suppression over their lifespan, as they fail to account for degraded bonds within or between shielding connections, which can occur due to long-term environmental exposure.
Innovation Solution
A bond-degradation device is introduced between normally-connected shielded connectors of the electrical control system, incorporating a resistive annulus to increase loop resistance and simulate degraded bonds, using complementary mating connectors and conductive wires to maintain connections while compromising shielding integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shielding is used to protect electrical circuits from EMI, then EMI protection is improved, but the system cannot test for bond degradation over time
Solution Approach 1:
The test device is connected to the shielded cable assembly before actual bond degradation occurs in service. The resistive annulus is pre-installed to simulate future bond degradation conditions, allowing proactive testing of EMI susceptibility and emission suppression without waiting for natural degradation to occur
Solution Approach 2:
The bond-degradation device acts as an intermediary component inserted between normally-connected shielded connectors. It includes a resistive annulus that introduces controlled resistance to simulate degraded bonds, while complementary mating connectors maintain electrical connections. This intermediary device enables testing of shielding effectiveness under simulated degradation conditions without removing the original shielding
2Object-affected harmful factors
If shielded connectors are normally connected to maintain shielding integrity, then EMI susceptibility is reduced, but bond degradation cannot be simulated for testing
Solution Approach 1:
The resistive annulus introduces resistance locally at specific bonding points within the shielded connector assembly, rather than uniformly degrading the entire shielding. This localized resistance simulation allows testing of EMI susceptibility at critical bond points while maintaining overall shielding structure integrity
Solution Approach 2:
The device changes the electrical resistance parameter of the shield bond by introducing a resistive annulus. This parameter change simulates the effect of bond degradation over time, allowing the system to test EMI susceptibility under varying resistance conditions without physically degrading the actual shields
3Adaptability or versatility
If the shielded cable assembly is modified to enable bond degradation testing, then testing capability is improved, but the original shielding effectiveness may be compromised
Solution Approach 1:
The bond-degradation device is segmented into separate functional components: complementary mating connectors for electrical connection, a resistive annulus for resistance introduction, and a conductive shield for maintaining shielding. This segmentation allows the testing function to be added without permanently modifying the original shielded cable assembly structure
Solution Approach 2:
The bond-degradation device creates a copied or simulated version of degraded bonding conditions rather than permanently altering the original shields. The resistive annulus copies the electrical characteristics of degraded bonds, allowing testing of shielding effectiveness under simulated degradation without compromising the actual shielding integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for comprehensive testing of EMI susceptibility and emission suppression by simulating various bond-degradation conditions, ensuring the electrical control system operates safely and efficiently under EMI exposure.
Implementation Method 1
The resistive annulus introduces a resistance between shields of the normally-connected first and second shielded connectors thereby compromising integrity of the shielding of conductive wires within the shielding of the shielded cable assembly by increasing loop resistance of the shielding
Implementation Method 2
shielding is the term used to describe enclosing the electric circuit within a grounded conductive enclosure... By doing so, electromagnetic signals generated external to such enclosures will be reflected and attenuated by the grounded conductive enclosure
Data Source
AI summary
Apparatus and associated methods relate to a bond-degradation device for testing EMI susceptibility and/or emission suppression of an electrical control system that includes a shielded cable assembly. The bond-degradation device includes a resistive annulus configured to be interposed between normally-connected first and second shielded connectors of the electrical control system. The resistive annulus introduces a resistance between shields of the normally-connected first and second shielded connectors, thereby compromising integrity of the shielding of conductive wires within the shielding of the shielded cable assembly by increasing loop resistance of the shielding.