Resistive Hotspot Temperature Sensor Using Metal Interconnect Stacks
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Solution Overview
Problem
The increased density of circuitry in integrated circuits leads to higher power consumption and localized temperature hotspots, making it challenging to implement accurate temperature sensors, particularly in systems-on-chips where bipolar-based sensors are prone to performance degradations and unpredictable accuracy.
Innovation Solution
The use of resistive temperature sensors with temperature-sensitive resistors, formed from metal interconnect stacks, that provide a differential temperature signal through a feedback resistor loop, allowing for precise temperature measurement with reduced structural complexity and sensitivity to mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If bipolar-based temperature sensors are used in systems-on-chips, then temperature measurement capability is provided, but performance degradation and unpredictable accuracy occur due to mechanical stress and process variations
Solution Approach 1:
The patent replaces the bipolar junction-based temperature sensing mechanism with a resistive sensing mechanism. Instead of relying on bipolar transistor characteristics that are sensitive to mechanical stress, the invention uses resistors formed from metal interconnect stacks whose resistance changes predictably with temperature. This substitution eliminates the mechanical stress sensitivity issue while maintaining temperature measurement capability.
Solution Approach 2:
The patent changes the fundamental sensing parameter from bipolar junction voltage/current characteristics to resistive properties. By measuring resistance changes in metal interconnect stacks that have known temperature coefficients, the system achieves more stable and predictable temperature measurements不受机械应力影响.
2Measurement precision
If traditional temperature sensors are implemented, then temperature monitoring is achieved, but significant chip area is consumed and power consumption increases
Solution Approach 1:
The patent makes the metal interconnect stacks serve dual functions: as electrical interconnects for circuit operation and as temperature sensing elements. The same metal layers that provide electrical connectivity also exhibit temperature-dependent resistance that can be measured for temperature sensing. This eliminates the need for separate dedicated sensor structures, thereby conserving chip area.
Solution Approach 2:
The invention merges the interconnect function and temperature sensing function into a single structural element. The metal interconnect stacks are designed to simultaneously carry electrical signals and provide temperature measurement capability through their resistive properties, reducing overall device footprint.
3Productivity
If high-density circuitry is implemented to increase transistor count, then processing power increases, but localized temperature hotspots are generated that require precise sensing
Solution Approach 1:
The patent implements temperature sensing at local hotspots within the high-density circuitry rather than using a single centralized sensor. By placing resistive sensing elements directly within or near high-power circuit blocks, the system can locally monitor temperature variations and provide feedback for targeted thermal management, enabling precise control of localized hotspots.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables accurate temperature sensing with reduced power consumption and chip area cost, comparable to bipolar junction-based sensors, while being less sensitive to mechanical variations and capable of operating at lower supply voltages.
Implementation Method 1
resistive temperature sensors with temperature-sensitive resistors, formed from metal interconnect stacks
Implementation Method 2
temperature-sensitive resistors, formed from metal interconnect stacks, that provide a differential temperature signal
Data Source
AI summary
Various techniques for implementing resistive temperature sensors that rely on the resistors' temperature sensitivity to provide temperature sensing are disclosed. Temperature sensitive resistors may be implemented in a resistor stack in combination with a resistor stack of resistors that are relatively temperature indifferent. Various temperature sensor circuits implementing these temperature sensitive resistors are also disclosed. A temperature sensor circuit may implement the temperature sensitive resistors along with the resistors that are relatively stable with temperature to output a voltage signal that is indicative of the temperature sensed by the circuit. In some instances, the signal from the temperature sensitive resistors is increased through the use of a feedback resistor loop.