Resistor Composition Laser Trimming
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Solution Overview
Problem
Miniaturized and thinned resistors with complex shapes face challenges in maintaining uniform resistance values, requiring easy adjustment through laser trimming while ensuring hardness and adhesion to substrates.
Innovation Solution
A resistor composition comprising copper, nickel, and lanthanum boride with copper particles of 2.5 µm or more, along with inorganic components like silicon oxide and glass, facilitates easy laser trimming by maintaining a specific mass ratio and particle diameter distribution, enhancing resistance value adjustability and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the resistor is miniaturized and thinned with complex shape, then the electronic device achieves miniaturization and high integration, but the resistance value varies and becomes difficult to control
Solution Approach 1:
The patent changes the physical and chemical parameters of the resistor material by specifying a particular composition ratio (copper 40-70 mass%, nickel 5-30 mass%, lanthanum boride 5-30 mass%) and copper particle size (2.5 μm or more) to enable laser trimming while maintaining miniaturization. This parameter optimization allows the small resistor to be adjusted after formation, resolving the contradiction between miniaturization and resistance value control.
2Manufacturing precision
If laser trimming is performed to adjust resistance value, then the resistance value can be precisely controlled, but the resistor material must be hard enough to withstand laser processing
Solution Approach 1:
The patent uses a composite material system combining copper particles (for conductivity and laser response), nickel (for hardness and structural stability), and lanthanum boride (for adhesion and thermal stability). This composite formulation enables the resistor to be both hard enough for laser trimming and adjustable in resistance value, resolving the contradiction between hardness and adjustability.
3Ease of manufacture
If copper particles with diameter of 2.5 μm or more are used, then laser trimming becomes easier and resistance value can be adjusted, but the resistor may have reduced adhesion to substrate
Solution Approach 1:
The patent employs a composite material system where copper particles (≥2.5 μm) provide laser trimming responsiveness, while nickel and lanthanum boride components ensure adequate adhesion to the substrate. The synergistic combination of these materials resolves the contradiction between ease of laser trimming and adhesion strength.
Solution Approach 2:
The patent applies different material functions to different aspects of the resistor: copper particles handle the laser trimming function, while the nickel and lanthanum boride matrix provides the adhesion function. This local quality differentiation allows the resistor to simultaneously achieve easy laser trimming and strong substrate adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resistor composition allows for precise adjustment of resistance values with reduced variation, improved hardness for trimming, and enhanced adhesion, facilitating efficient laser trimming and stability on substrates.
Implementation Method 1
when the resistor is irradiated with a laser beam, copper particles having a particle diameter of 2.5 μm or more are likely to be shed, so laser trimming can be easily performed
Implementation Method 2
the resistance value of the resistor can be increased
Data Source
Figure 1~2
AI summary
A resistor according to the present disclosure includes copper, nickel, and lanthanum boride, a total content of which is 40% by mass or more, the resistor including copper particles having a particle diameter of 2.5 µm or more. In addition, a circuit board according to the present disclosure includes a substrate; the resistor described above, which is located on the substrate; a metal layer; and a glass layer located on the resistor. Further, an electronic device according to the present disclosure includes the circuit board described above; and an electronic component located on the metal layer of the circuit board.