Miniature Resistor Die Sizing for Dimensional Accuracy
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Solution Overview
Problem
Existing resistors face challenges in reducing size while maintaining dimensional accuracy, which is essential for high-density circuit board mounting in advanced electronic devices.
Innovation Solution
A manufacturing method involving the stacking and bonding of electrode materials, resistive materials, and electrode materials, followed by passing the resistor base material through a die with a smaller opening to achieve the desired size, while ensuring the resistive material is bonded with electrode materials using diffusion bonding to maintain accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the resistor size is reduced to achieve high-density mounting, then the mounting density is improved, but the dimensional accuracy deteriorates
Solution Approach 1:
The resistor base material is prepared in advance with a size larger than the final resistor dimensions. This preliminary sizing allows subsequent precision processing through the die to achieve the target small dimensions while maintaining manufacturing accuracy, rather than attempting to directly form the final small size which would compromise dimensional control.
Solution Approach 2:
A die with a precisely controlled opening portion serves as an intermediary tool between the resistor base material and the final resistor product. The die's opening acts as a template that transfers precise dimensional information to the resistor, enabling accurate size reduction while maintaining manufacturing precision through the mediating function of the die's structured opening.
2Length of moving object
If the resistor base material is passed through a die with smaller opening, then the resistor size is reduced, but the handling difficulty increases
Solution Approach 1:
The resistor base material is prepared with a larger size before die processing. This preliminary larger dimension facilitates easier handling and insertion into the die, while the subsequent die processing achieves the final reduced dimensions. The preliminary action of preparing a larger base material resolves the handling difficulty that would arise from attempting to handle already-minimized resistor sizes.
Solution Approach 2:
Instead of starting with small resistor dimensions and attempting to handle them directly, the process is inverted by starting with a larger base material that is easier to handle, and then reducing the dimensions through the die. This inversion of the size sequence resolves the handling difficulty by ensuring that the material is most manageable at the stage where it is largest.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the reduction of resistor size while maintaining dimensional accuracy, enabling high-density mounting on circuit boards and improving handling properties during manufacturing.
Implementation Method 1
a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material
Data Source
AI summary
A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.