Resistor Electrode Printing for Reliable Miniaturization
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Solution Overview
Problem
Conventional resistors have an unreliable connection between the resistive element and electrodes due to partial overlap and direct contact, leading to an insufficient connection area, which affects miniaturization and resistance accuracy.
Innovation Solution
The resistors are manufactured using a method where electrodes are formed by printing metal powder-containing paste on a metal plate, with a protective film covering the resistive element and electrodes, and then grinding to expose the electrodes, ensuring a strong bond and accurate resistance value. This method includes forming belt-shaped electrodes on a sheet-shaped resistive element, cutting it into individual elements, and applying insulating films to enhance connection reliability and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are formed by plating method with protective film, then manufacturing process is conventional, but connection area is insufficient and connection reliability is poor
Solution Approach 1:
The patent changes the electrode formation method from plating to screen printing with metal powder-containing paste, which allows for larger electrode area and better connection reliability. The paste printing method creates a more substantial electrode structure that increases the effective connection area between electrodes and resistive element, directly resolving the contradiction between connection reliability and connection area.
2Volume of moving object
If resistor size is reduced for miniaturization, then device compactness is improved, but resistance accuracy deteriorates
Solution Approach 1:
The patent uses screen printing with metal powder-containing paste to create electrodes with optimized geometry and distribution. This method allows precise control of electrode dimensions and positioning even in miniaturized resistors, maintaining accurate resistance values while reducing overall device volume. The paste formulation and printing process enable scaling to smaller sizes without sacrificing measurement precision.
3Reliability
If protective film covers entire surface, then protection is complete, but electrode exposure requires additional grinding step
Solution Approach 1:
The patent applies protective film selectively rather than uniformly across the entire surface. The film is applied to cover the resistive element while leaving electrode areas exposed or easily accessible. This localized protection approach maintains protective coverage where needed while eliminating or simplifying the grinding step, reducing manufacturing process complexity without compromising protective function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains high connection reliability and allows for the production of compact low-resistance resistors with improved accuracy and reduced resistance values, even during miniaturization, by ensuring a stable and strong bond between the resistive element and electrodes.
Implementation Method 1
electrodes are formed by printing paste containing resin and metal powder contained in the resin
Implementation Method 2
grinding the protective film until the electrodes are exposed
Data Source
AI summary
A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.