Resistor Electrode Design for Thermal Dissipation

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Solution Overview

Problem

Conventional resistor structures suffer from inadequate heat dissipation due to limited heat transfer from the resistance layer to the electrodes and subsequent dissipation into the air.

Innovation Solution

A resistor structure with a larger resistance layer and electrodes that increase the air-contact area, allowing for enhanced heat conduction and dissipation by extending the electrodes to cover the substrate and side edges, thereby increasing the heat dissipation area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the conventional resistor structure with limited electrode area is used, then the manufacturing is simple, but the heat dissipation efficiency is poor

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent extends the electrodes from the traditional end-face contact configuration to cover the side edges and surfaces of the substrate, effectively transitioning from a one-dimensional heat transfer path to a three-dimensional heat dissipation structure. This dimensional expansion increases the electrode-air contact area and improves heat dissipation efficiency without significantly complicating the manufacturing process

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The resistor structure is divided into distinct functional zones: the resistance layer for heat generation, the substrate for structural support, and the extended electrodes for heat dissipation. This segmentation allows each component to be optimized for its specific function, with electrodes specifically designed to maximize surface area for thermal exchange with the surrounding air

Inventive Principle:

Principle #1Segmentation

2Area of stationary object

If the electrode area is increased to improve heat dissipation, then the heat dissipation efficiency is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improveelectrode air-contact areaVSAvoidmanufacturing ease

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent merges the electrode structure with the substrate geometry, where the electrodes extend along the side edges of the substrate rather than being separate components. This integration allows the electrodes to be formed as part of the substrate fabrication process, increasing the air-contact area while avoiding the need for additional assembly steps or complex manufacturing procedures

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly improves heat dissipation efficiency by increasing the contact area between the resistance layer and electrodes, facilitating better heat conduction and dispersal into the air.

Implementation Method 1

The heat is generated by the resistive layer 11 flows to the two electrodes 12 and then dissipated into the air

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

The heat is generated by the resistive layer 11 flows to the two electrodes 12

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4068310A1One-piece resistor structure with high-power

Publication Date: 2022.10.05 VIKING TECH CORP

Figure 1~2
Figure 3~4

AI summary

A resistor structure is proposed herein. The electrodes are on its resistance layer and have larger area. The large area electrodes enlarge the contact area with the resistance layer and the air to have a good heat conduction and good heat dissipation.