Resistor Element With Substrate Grooves For High Resistance
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Solution Overview
Problem
Conventional resistor elements with 2-dimensional resistant layers are limited in achieving high resistance due to constrained current paths, making it difficult to meet the requirements of electronic circuits needing higher resistance without increasing size.
Innovation Solution
The introduction of grooves on the substrate increases the current paths by creating height drops between the substrate surface and the groove bottom surfaces, allowing the resistant layer to cover the grooves and increase resistance, with resistance levels ranging from 110% to 700% of conventional elements for the same size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional 2-dimensional resistant layer is used, then the structure is simple, but the resistance is limited and cannot achieve high resistance values
Solution Approach 1:
The patent transitions from a 2-dimensional resistant layer to a 3-dimensional structure by forming grooves on the substrate surface and filling them with resistant material. This dimensional change creates additional current paths through the groove depth, significantly increasing resistance without requiring a larger planar area. The resistant layer now extends in three dimensions (length, width, and depth), allowing higher resistance values to be achieved within the same footprint.
2Reliability
If the size of the resistor element is increased to achieve higher resistance, then the resistance increases, but the device size becomes larger
Solution Approach 1:
Instead of increasing the planar area to achieve higher resistance, the patent utilizes the vertical dimension by forming grooves with controlled depth. The resistant material fills these grooves, creating extended current paths that increase resistance without expanding the device's footprint. This allows high resistance values to be achieved within compact dimensions.
Solution Approach 2:
The patent changes the geometric parameters of the resistant layer by controlling groove depth, width, and shape. By adjusting these parameters, the resistance can be precisely controlled to achieve desired values without changing the overall device size. The depth-to-width ratio of the grooves becomes a critical parameter for resistance control.
3Reliability
If the distance between electrodes is increased to achieve higher resistance, then the resistance increases, but the device length increases
Solution Approach 1:
The patent creates additional resistance by utilizing the vertical dimension through groove formation, rather than increasing the horizontal distance between electrodes. The grooves provide extra current path length through their depth, allowing higher resistance to be achieved without extending the device length or increasing electrode spacing.
4Reliability
If grooves are formed on the substrate, then the resistance increases due to increased current paths, but the manufacturing process becomes more complex
Solution Approach 1:
The patent utilizes a filling process where resistant material is deposited into the groove structures. This approach simplifies manufacturing compared to forming complex 3D structures from scratch, as the grooves can be created using standard etching techniques and then filled with resistant material through conventional deposition or screen printing methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of resistor elements with higher resistance without increasing size or distance to electrodes, making them suitable for applications in flexible display devices and wearable electronics.
Implementation Method 1
the resistant layer 3 is formed on the substrate 1 and electrically connected with the pair of electrodes 2... the current paths thereof are constrained by the distances to the electrodes... the resistor element of the present invention, which has grooves, has 110% to 700% the resistance of the conventional resistor element
Data Source
AI summary
A resistor element is provided, comprising a substrate including an upper surface and lower surface opposite to each other; a pair of electrodes separately disposed on the upper surface; at least one first groove extended from the upper surface to lower surface and defined by first side walls and a first bottom surface, wherein the depth from the upper surface of the substrate to the first bottom surface is a first depth; and a resistant layer disposed on the upper surface and electrical connected to the pair electrodes. The resistant layer covers the first side wall, the first bottom surface and part of the upper surface. The substrate with grooves increases the current path of the resistant layer, so that the resistor element having higher resistance can be obtained.