Resistor Element With Exposed Side Surfaces

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The miniaturization of electronic devices has led to the need for smaller resistor elements, but existing manufacturing methods are inefficient and costly, requiring a reduction in the number of manufacturing operations to produce these elements effectively.

Innovation Solution

A resistor element design featuring a substrate with exposed side surfaces and strategically placed electrode layers, where side electrode layers are only on curved surfaces, reducing the number of manufacturing operations by eliminating the need for separate side surface metal layers and simplifying the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional manufacturing methods are used with metal layers on all side surfaces, then electrical connection is ensured, but the number of manufacturing operations increases and production efficiency decreases

Engineering Contradiction:
Improveproduction efficiencyVSAvoidnumber of manufacturing operations
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies local quality by placing metal electrode layers only on specific curved side surfaces of the substrate rather than uniformly on all side surfaces. This selective placement reduces the number of manufacturing operations while ensuring electrical connections are established only where needed for current flow between opposing electrode layers, thereby improving production efficiency without compromising essential electrical functionality.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If metal layers are placed on all side surfaces, then electrical connection is ensured, but production cost increases

Engineering Contradiction:
Improveproduction costVSAvoidelectrical connection
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent reduces production cost by applying metal electrode layers only to specific curved side surfaces where electrical connection is required, rather than coating all side surfaces. This selective approach minimizes material usage and manufacturing steps while maintaining reliable electrical connections through the strategic placement of electrodes that facilitate current flow between opposing layers.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent extracts unnecessary metal layer applications from flat side surfaces where electrical connection is not needed. By removing these redundant metal layers, the production cost is reduced while the essential electrical connection function is preserved through the remaining strategically placed electrode layers on curved surfaces.

Inventive Principle:
Principle #2Taking out (Extraction)

3Manufacturing precision

If side electrode layers are added to all side surfaces, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improveelectrode placement precisionVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent achieves manufacturing precision by focusing electrode layer application only on curved side surfaces where precise electrical connection is needed, rather than uniformly treating all side surfaces. This localized approach maintains high manufacturing precision for critical connection points while reducing overall structural complexity by eliminating unnecessary electrode layers from flat surfaces.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10332660B2Resistor element
Publication Date: 2019.06.25 SAMSUNG ELECTRO MECHANICS CO LTD
  • US10332660B2 patent drawing
  • US10332660B2 patent drawing
  • US10332660B2 patent drawing

AI summary

A resistor element includes a substrate having first and second surfaces facing each other, and a plurality of side surfaces connecting the first surface and the second surface with each other. A resistance layer is on at least one of the first and second surfaces. A first terminal and a second terminal are connected to the resistance layer, and each include a first electrode layer on the first surface, a second electrode layer on the second surface, and a plurality of side electrode layers on at least a portion of the plurality of side surfaces. At least a portion of the side surfaces of the substrate is exposed between side electrode layers of the first terminal.