Resistor Network Compensation for Package Stress and Temperature Drift

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Solution Overview

Problem

Existing electrical circuits face challenges in maintaining invariant operation across variations in temperature and stress, particularly in industrial and automotive applications, due to the sensitivity of resistors to package stress and temperature changes, which current compensation methods either consume significant semiconductor die area or increase error potential.

Innovation Solution

A circuit design utilizing multiple resistors with different stress sensitivities and temperature coefficients, linearly combined with weighted ratios, to achieve an effective stress sensitivity and temperature coefficient within target thresholds, reducing sensitivity to package stress and temperature while minimizing die area consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional compensation methods are used to maintain circuit operation invariance, then temperature and stress sensitivity is reduced, but semiconductor die area consumption increases significantly

Engineering Contradiction:

Improvecircuit operation invarianceVSAvoidsemiconductor die area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines multiple resistors with different stress sensitivities and temperature coefficients into a single integrated compensation circuit. By linearly combining these resistors with weighted ratios, the circuit achieves temperature and stress compensation while consuming minimal die area, resolving the contradiction between reliability and area consumption.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the parameters of resistors (stress sensitivity and temperature coefficient) by selecting specific resistor types and configurations. By adjusting the weighted ratios of combined resistors, the circuit achieves target thresholds for stress sensitivity and temperature coefficient, maintaining operation invariance without requiring large die area.

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If complex compensation circuits are implemented to reduce sensitivity to package stress and temperature, then circuit stability improves, but device complexity increases

Engineering Contradiction:

Improvecircuit stabilityVSAvoidcircuit complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent segments the compensation function into multiple resistor elements with distinct characteristics (different stress sensitivities and temperature coefficients). Each resistor handles a specific aspect of compensation, and their linear combination achieves overall stability without requiring complex control logic or additional components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The compensation circuit performs multiple functions simultaneously: it compensates for both temperature variations and package stress effects using a unified resistor network. This multi-functionality is achieved through the linear combination of resistors with different characteristics, eliminating the need for separate compensation circuits and reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The circuit effectively compensates for package stress and temperature variance, maintaining invariant operation with reduced sensitivity and minimal area usage, suitable for industrial and automotive applications.

Implementation Method 1

a capacitor including a first terminal and a second terminal, the first terminal of the capacitor coupled to the second terminal of the first switch

Methodology Applied

Scientific EffectCapacitance: Capacitance

Data Source

PatentUS20260005650A1Methods and apparatus to compensate for package stress variance or temperature variance

Publication Date: 2026.01.01 TEXAS INSTRUMENTS INC

AI summary

An example apparatus includes a first resistor including a first terminal coupled to a first output terminal of a current mirror and a second terminal coupled to a ground terminal. The apparatus includes a first switch including a first terminal coupled to a second output terminal of the current mirror, a capacitor including a first terminal coupled to a second terminal of the first switch, and a second resistor including a first terminal coupled to a second terminal of the capacitor and a second terminal coupled to the ground terminal. The apparatus includes a second switch including a first terminal coupled to the first terminal of the capacitor and a second terminal coupled to the ground terminal, a third switch including a first terminal coupled to the first terminal of the capacitor, and a comparator including an input terminal coupled to a second terminal of the third switch.