Resistor Segmentation for Oscillation Frequency Stability
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Solution Overview
Problem
The variation in resistance value of the reference resistor due to stress caused by resin sealing in semiconductor chips leads to instability in oscillation frequency, affecting the performance of semiconductor devices with embedded oscillation circuits.
Innovation Solution
A semiconductor device design with a voltage-current converting unit, a voltage generating unit, and an oscillation unit, where the reference resistor is formed in a specific pattern on the semiconductor chip to minimize stress-induced resistance variations, using a plurality of resistors connected in series and orthogonal to the direction of stress, and strategically positioned to reduce deformation and maintain stable oscillation frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the reference resistor is embedded in the semiconductor chip and sealed with resin, then the oscillation circuit can be downsized and integrated, but stress from resin sealing causes resistance value variation and oscillation frequency instability
Solution Approach 1:
The reference resistor is divided into multiple resistor elements arranged in a specific pattern on the semiconductor chip. This segmentation allows the resistor structure to better distribute and manage stress from resin sealing, reducing overall resistance value variation while maintaining the compact integrated design.
Solution Approach 2:
The resistor elements are strategically positioned in regions of the semiconductor chip that experience different stress characteristics. By placing resistors in specific locations (e.g., near corners or along stress distribution patterns), the design optimizes local stress management to minimize resistance variation while maintaining integration.
2Reliability
If the reference resistor is made more robust to resist stress, then oscillation frequency stability improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
Multiple resistor elements are combined in a specific configuration to achieve the desired resistance value and stress resistance. This merging approach creates a robust structure that resists stress-induced variation while maintaining a relatively simple manufacturing process that can be integrated into existing semiconductor fabrication.
Solution Approach 2:
The reference resistor structure uses composite material layers (e.g., different resistive materials or stress-compensating layers) that provide both the required electrical resistance and mechanical stress resistance. This composite structure improves oscillation frequency stability without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively stabilizes the oscillation frequency by reducing the impact of stress-induced resistance variations, enhancing the performance and reliability of semiconductor devices with embedded oscillation circuits.
Implementation Method 1
a voltage-current converting unit which converts a voltage into a current by utilizing a reference resistor
Implementation Method 2
the semiconductor chip has an oscillation circuit, and the semiconductor chip is sealed with a resin. Due to the resin sealing of the semiconductor chip, stress is adversely caused in the semiconductor chip, and therefore, the resistance value of the reference resistor embedded in the semiconductor chip is varied by the stress
Data Source
AI summary
A semiconductor device is formed by sealing, with a resin, a semiconductor chip (CP1) having an oscillation circuit utilizing a reference resistor. The oscillation circuit generates a reference current by utilizing the reference resistor, a voltage is generated in accordance with this reference current and an oscillation frequency of the oscillation unit, and the oscillation unit oscillates at a frequency in accordance with the generated voltage. The reference resistor is formed of a plurality of resistors, which extend in a first (Y) direction orthogonal to a first side, inside a first region (RG1, RG2, RG3, and RG4) surrounded by the first side (S1, S2, S3, and S4) of a main surface of the semiconductor chip (CP1), a first line (42, 43, 44, and 45) connecting between one end of the first side and the center (CT1) of the main surface of the semiconductor chip, and a second line (42, 43, 44, and 45) connecting between the other end of the first side and the center of the main surface of the semiconductor chip.