Resistor With Segmented Metal Heat Radiator Plates

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Solution Overview

Problem

Conventional resistors with resistive elements experience high temperatures due to inadequate heat dissipation, leading to reduced long-term reliability and power handling capabilities, especially in high-power electronic devices.

Innovation Solution

The resistor design incorporates a resistive element with a high thermal conductivity resin substrate and metal heat radiator plates separated by gaps, allowing efficient heat dissipation through edge-surface electrodes, reducing the resistive element's temperature and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional resistors with simple heat dissipation structures are used, then device complexity is reduced, but temperature of the resistive element increases leading to reduced reliability

Engineering Contradiction:

Improvelong term reliabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The heat radiator plate is divided into multiple segments separated by gaps, allowing heat to be dissipated through multiple paths while maintaining structural integrity. This segmentation enables more effective heat management compared to a solid plate, resolving the contradiction between reliability and complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Resin substrates are introduced as intermediary layers between the resistive element and heat radiator plates, and between heat radiator plates. These intermediaries facilitate thermal conduction while providing electrical insulation and structural support, enabling the complex multi-layer structure to achieve superior heat dissipation and reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Power

If inadequate heat dissipation structures are used, then manufacturing cost and complexity are reduced, but temperature of resistive element increases reducing power handling capability

Engineering Contradiction:

Improvepower handling capacityVSAvoidheat dissipation structure complexity

Core Design Contradiction:

PowerVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Heat dissipation is enhanced by utilizing multiple dimensions through stacked heat radiator plates and resin substrates. The multi-layer configuration creates additional thermal conduction pathways in the vertical dimension, significantly improving power handling capacity while distributing thermal load across multiple surfaces.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If high thermal conductivity materials and multi-layer heat dissipation structures are used, then temperature reduction is improved, but device complexity increases

Engineering Contradiction:

Improveresistive element temperatureVSAvoidmulti-layer structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent employs composite structures combining metal heat radiator plates with resin substrates. The metal plates provide high thermal conductivity for efficient heat dissipation, while the resin substrates provide electrical insulation and structural support. This composite approach achieves superior temperature control while managing the inherent complexity through material property optimization.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The resin substrates serve multiple functions simultaneously: electrical insulation between conductive layers, thermal conduction pathway, mechanical support for mounting components, and structural bonding between layers. This multi-functionality reduces the need for separate components, managing complexity while achieving effective temperature reduction.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly reduces the temperature of the resistive element, improving long-term reliability and power handling capacity by effectively dissipating heat generated, thus addressing the limitations of conventional resistor designs.

Implementation Method 1

a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10141088B2Resistor

Publication Date: 2018.11.27 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.