Resistor Support Assembly for Airflow and Parasitic Reduction
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Solution Overview
Problem
Conventional resistor support structures cause parasitic capacitance and inductance effects, obstruct airflow, and can be unreliable due to heavy materials and soldering issues, leading to overheating and mechanical stress on resistors.
Innovation Solution
A resistor support assembly using non-conductive materials like silicone, nylon, and FR-4, with apertures and recesses to allow unobstructed airflow and secure mounting of resistors without soldering, utilizing bolts and support members to distribute compression forces and provide strain relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If metallic rod and brackets are used to support the resistor, then mechanical strength and stability are improved, but parasitic capacitance and inductance increase, and airflow is obstructed causing overheating
Solution Approach 1:
The patent removes the metallic rod from the hollow portion of the resistor, extracting the source of parasitic capacitance and inductance. Instead, non-conductive support members are used to hold the resistor, eliminating the harmful electromagnetic effects while maintaining mechanical support through alternative means such as mounting the resistor on a circuit board with non-conductive adhesive or mechanical features.
Solution Approach 2:
The patent employs a support member with a porous or mesh structure that allows airflow to pass through the hollow portion of the resistor. This porous structure provides mechanical support while maintaining unobstructed airflow paths, preventing overheating while still providing structural stability.
2Strength
If metallic rod and brackets are used to support the resistor, then mechanical strength and stability are improved, but airflow through the hollow portion is obstructed causing overheating
Solution Approach 1:
The support member incorporates a porous or mesh structure with open cells that allow air to flow freely through the hollow portion of the resistor. This maintains thermal management by enabling convective cooling while still providing the necessary mechanical support through the distributed structure of the porous material.
Solution Approach 2:
The patent uses composite material structures combining rigid and flexible components, or materials with specific thermal and mechanical properties, to create a support system that provides structural integrity without blocking airflow. The composite approach allows optimization of both mechanical strength and thermal management characteristics.
3Reliability
If heavy materials like Teflon are used for support structures, then reliability and insulation are improved, but airflow is obstructed and cost increases
Solution Approach 1:
The patent employs porous or mesh-based support members made from materials with appropriate mechanical and insulating properties. These porous structures maintain reliability and electrical insulation while allowing airflow to pass through, preventing the overheating issues associated with solid heavy materials like Teflon.
4Reliability
If metallic components are soldered to printed circuit boards, then electrical connection is improved, but reliability decreases due to solder cracking
Solution Approach 1:
The patent removes the soldered metallic connection approach and replaces it with non-conductive support members that mechanically mount the resistor to the circuit board. This extraction of the solder joint eliminates the source of cracking and reliability issues, using alternative mounting methods such as non-conductive adhesive or mechanical retention features integrated into the support structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures efficient cooling of resistors, reduces parasitic effects, enhances reliability by preventing overheating and mechanical stress, and allows for easy assembly and adaptability to different resistor dimensions and compositions.
Implementation Method 1
airflow through the hollow portion of the load resistor may be unobstructed... which can cause the cylindrical load resistor to overheat
Data Source
AI summary
A resistor support assembly includes first, second, third, and fourth support members. Each of the first and second support members includes one or more resistor contact regions and apertures extending therethrough. Each third support member is at least partially disposed within one of the apertures of one of the first support members and one of the apertures of one of the second support members. Recesses may be formed in the resistor contact regions of the first and the second support members, and one or more load resistors may be at least partially disposed within the recesses. The resistor support assembly may be used to mount one or more load resistors to a printed circuit board, without obstructing airflow through hollow portions of the load resistors. To reduce parasitic capacitance and inductance, the first support members and the second support members are formed from non-conductive materials.