Resistor Trimming Method Using Segmented Laser Grooves
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing resistor trimming methods, such as the 'scanning and cutting' technique, face inefficiencies when initial resistance values of chip resistors are higher than -10% relative to the target value, leading to prolonged trimming times and reduced production efficiency due to the need for sudden starting of scanning and cutting processes.
Innovation Solution
A resistor trimming method where a first trimming groove is formed linearly from one side surface of the resistor, and the endpoint of this groove serves as a start point for a second trimming groove, intersecting with the first groove to adjust the resistance value with precision, allowing for continuous processing and improved efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the scanning and cutting method is used to form an inverted U-shaped trimming groove, then ultrahigh precision in resistance value adjustment is achieved, but processing time is prolonged when initial resistance values are higher than -10% relative to the target value
Solution Approach 1:
The trimming groove is divided into two distinct parts: a first trimming groove formed by linear laser irradiation and a second trimming groove formed by scanning and cutting. This segmentation allows the process to handle different initial resistance value scenarios efficiently, avoiding the time-consuming sudden start of scanning and cutting while maintaining precision through the combined effect of both groove types.
Solution Approach 2:
The first trimming groove is formed in advance through linear laser irradiation before the second trimming groove is created by scanning and cutting. This preliminary action pre-adjusts the resistance value and creates a foundation that reduces or eliminates the need for sudden scanning and cutting operations, thereby reducing processing time while maintaining the precision benefits of the scanning and cutting method.
2Productivity
If linear laser irradiation is used to form a trimming groove, then processing efficiency is improved, but resistance value adjustment precision is insufficient compared to scanning and cutting methods
Solution Approach 1:
The method merges two different trimming approaches: the efficient linear laser irradiation method (first trimming groove) and the precise scanning and cutting method (second trimming groove). By combining these methods in sequence, the invention achieves both high processing efficiency from the linear irradiation and ultrahigh precision from the scanning and cutting, resolving the contradiction between efficiency and precision.
Solution Approach 2:
Different parts of the trimming process are assigned different methods based on their specific requirements: the first trimming groove uses linear laser irradiation for efficient bulk material removal and initial resistance adjustment, while the second trimming groove uses scanning and cutting for precise final adjustment. This local quality assignment optimizes both efficiency and precision in their respective domains.
3Manufacturing precision
If sudden starting of scanning and cutting is performed when initial resistance values are higher than -10%, then the trimming process can be completed, but production efficiency is reduced due to prolonged processing time
Solution Approach 1:
The first trimming groove is formed through linear laser irradiation before the scanning and cutting process begins. This preliminary action pre-adjusts the resistance value and reduces the amount of material that needs to be removed by scanning and cutting, thereby eliminating or reducing the sudden start delay and improving production efficiency without compromising the precision of the final resistance adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables ultrahigh precision in resistance value adjustment while reducing processing time and enhancing production efficiency by suppressing sudden starts in scanning and cutting, even when initial resistance values are higher than -10% relative to the target.
Implementation Method 1
irradiating a resistor with laser light to form a trimming groove in the resistor to thereby adjust a resistance value of the resistor
Data Source
AI summary
The invention is to provide a resistor trimming method capable of adjusting a resistance value with ultrahigh precision and having excellent production efficiency. To achieve the object, a start point (S1) at a distance from a resistor (4) is irradiated with laser light while probes are brought into contact with a pair of surface electrodes (3) to measure a resistance value of the resistor (4). The place irradiated with the laser light is scanned so that a first trimming groove (5) extending in a direction perpendicular to a current direction can be formed in the resistor (4). Then, the place irradiated with the laser light is returned by a predetermined amount from an end point (first turning point (T1)) of the first trimming groove (5) to be set as a second turning point (T2). With the second turning point (T2) as a start point, scanning and cutting is performed to forma second trimming groove (6). Thus, the resistance value of the resistor (4) is adjusted to a target resistance value with high precision.