Resistor Units on Ceramic Substrate via Segmented Cutting

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Solution Overview

Problem

Current methods are unable to manufacture resistor units with dimensions smaller than 0.8 mm by 0.6 mm efficiently, reliably, and inexpensively for use in compact electrical components and devices.

Innovation Solution

A method involving a carrier plate with resistor material strips and electrically conductive zones applied in a regular pattern, where the strips and zones overlap to form electrical terminals, and the carrier plate is cut to separate resistor units, allowing for precise control of terminal size and efficient production of compact resistor units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional methods are used to manufacture resistor units, then manufacturing process simplicity is maintained, but minimum dimensions of 0.8 mm x 0.6 mm cannot be achieved

Engineering Contradiction:

Improveresistor unit dimensionsVSAvoidmanufacturing process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into distinct stages: forming resistor material strips, forming electrically conductive zones, overlapping them to create terminals, and finally cutting to separate individual resistor units. This segmentation enables precise control over terminal dimensions while maintaining manufacturing efficiency

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The electrically conductive zones are formed in advance on the carrier plate before the resistor material strips are applied. This preliminary action allows the terminal regions to be pre-positioned and sized accurately, enabling miniaturization while ensuring proper electrical connections are established before final separation

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If resistor unit size is reduced for compact devices, then adaptability to compact components improves, but manufacturing reliability deteriorates

Engineering Contradiction:

Improveadaptability to compact devicesVSAvoidmanufacturing reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The method applies different material properties locally: resistor material with specific resistivity for the resistive elements, and electrically conductive material with high conductivity for the terminal zones. This local differentiation ensures that even at reduced sizes, each region maintains its required electrical characteristics and connection reliability

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The electrically conductive zones serve as intermediary elements between the resistor material strips and the external circuit connections. These intermediate conductive regions ensure reliable electrical contact is maintained during the cutting separation process and in the final miniaturized structure

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If resistor unit dimensions are reduced below 0.8 mm x 0.6 mm, then suitability for compact devices improves, but conventional manufacturing methods become ineffective

Engineering Contradiction:

Improveresistor unit sizeVSAvoidmanufacturability

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The resistor material strips and electrically conductive zones are merged by overlapping them to form integrated terminal structures. This merging creates a unified component where the terminal regions inherently combine both electrical connection and mechanical attachment functions, enabling miniaturization while simplifying the overall manufacturing process

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention transitions from planar resistor elements to three-dimensional overlapping structures where resistor strips are positioned over conductive zones. This dimensional approach allows terminal regions to be formed with precise area control, enabling sub-0.8 mm dimensions while maintaining manufacturability through standard thin-film deposition and patterning techniques

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11302462B2Method for producing a plurality of resistance modular units over a ceramic substrate

Publication Date: 2022.04.12 VISHAY ELECTRONICS

AI summary

A method of manufacturing resistor units that each comprise a carrier comprising resistor elements including ends with a respective first and second electrical terminal is disclosed. The method includes: a) providing a carrier plate; b) forming strips of a resistor material at the lower side of the carrier plate in a regular pattern such that a respective row of strips of the resistor material is formed along a longitudinal direction; c) forming a plurality of zones of an electrically conductive material at the lower side of the carrier plate in a regular pattern such that a respective row of zones of the electrically conductive material is formed along the longitudinal direction; and d) cutting through the carrier plate by regular transverse incisions, first longitudinal incisions, and second longitudinal incisions such that a respective resistor unit and a respective residual section are alternately formed along a transverse direction.