Resonance Control Circuits for Uniform Multi-Module Substrate Processing
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Solution Overview
Problem
The variation in processing degrees among process modules in a substrate processing apparatus due to machining errors and impedance differences from the RF power source, leading to inconsistent etch rates in semiconductor manufacturing.
Innovation Solution
A method and apparatus that adjust and match the resonance points of process modules by controlling variable elements in resonance control circuits, including cable lengths and impedance controllers, to ensure consistent processing across modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple process modules are used to increase substrate processing capacity, then productivity increases, but processing consistency deteriorates due to machining errors and impedance variations
Solution Approach 1:
The patent adjusts resonance parameters (frequency and impedance) of each process module by modifying cable lengths and impedance controller settings. This allows customization of electrical parameters to compensate for manufacturing variations, ensuring consistent plasma generation across all modules while maintaining high productivity
Solution Approach 2:
The patent implements a feedback mechanism where resonance points of each process module are measured and compared against target values. Based on measured deviations, the system automatically adjusts cable lengths and impedance controller parameters to correct inconsistencies, ensuring uniform processing across all modules
2Device complexity
If process modules operate with different resonance points due to machining errors, then device complexity increases, but processing uniformity deteriorates
Solution Approach 1:
The patent adjusts resonance parameters (frequency and impedance) of each process module by modifying cable lengths and impedance controller settings. This allows customization of electrical parameters to compensate for manufacturing variations, ensuring consistent plasma generation across all modules
Solution Approach 2:
The patent introduces adjustable and controllable elements (variable impedance controllers and adjustable cable lengths) that allow dynamic tuning of resonance characteristics. This enables real-time adaptation to compensate for manufacturing tolerances and maintain uniform processing conditions across all modules
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures uniform processing of substrates by matching resonance points, maintaining consistent etch rates and substrate quality across multiple process modules.
Implementation Method 1
matching resonance points of a first process module and a second process module different from the first process module with each other; adjusting the resonance points of the first process module and the second process module that change while performing the first substrate processing operation to initial resonance points
Implementation Method 2
a first power source that is an RF power source for generating plasma or regulating a flow of plasma in the first chamber; a second power source that is an RF power source for generating plasma or regulating a flow of plasma in the second chamber
Data Source
AI summary
Disclosed is a manufacturing method including: a device setup operation of matching resonance points of a first process module and a second process module different from the first process module with each other; a first substrate processing operation of processing a substrate in the first process module and/or the second process module; and a resonant frequency control operation of adjusting the resonance points of the first process module and the second process module that change while performing the first substrate processing operation to initial resonance points, in which the resonant frequency control operation includes controlling at least one of a variable element of a first resonance control circuit of the first process module and a variable element of a second resonance control circuit of the second process module to adjust the resonance points of the first process module and the second process module to the initial resonance points.