Resonance Device Stacked Conductive Layers Q-Factor

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Solution Overview

Problem

Conventional resonance devices struggle to achieve a high Q-factor and reduced size while maintaining flexible design capabilities, particularly in RF filters used for wireless communication systems.

Innovation Solution

A resonance device with a stacked structure comprising multiple conductive layers and a dielectric substance, where the layers are grounded and ungrounded in specific configurations, forming an LC resonance circuit within a conductive case to enhance Q-factor and size reduction, and including multiple resonators for improved filtering characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional resonator structure (PCB, dielectric resonator, or mono block) is used, then the device can be manufactured with existing processes, but it is difficult to achieve both high Q-factor and reduced size simultaneously

Engineering Contradiction:
ImproveQ-factorVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The resonator is divided into multiple conductive layers (first conductive layer, second conductive layer, third conductive layer) stacked vertically within the case. Each layer serves a specific function: the first layer is grounded, the second layer forms the resonant element, and the third layer provides additional grounding. This segmentation allows for optimized electromagnetic field distribution and higher Q-factor while maintaining compact dimensions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from planar resonator designs to a three-dimensional stacked structure. By stacking conductive layers vertically (in the Z-dimension) rather than expanding horizontally, the design achieves higher Q-factor and improved performance without increasing the footprint area, effectively utilizing the third dimension to resolve the size-Q-factor tradeoff.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the second conductive layer is separated from the first conductive layer without being grounded, then the resonance characteristics are improved, but the structural complexity increases

Engineering Contradiction:
Improveresonance characteristicsVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A dielectric substance is introduced as an intermediary material between the first conductive layer (grounded) and the second conductive layer (ungrounded). This dielectric layer provides electrical isolation while maintaining mechanical support and defining the capacitance of the resonant structure. The intermediary dielectric enables the ungrounded configuration to achieve superior resonance characteristics without requiring complex isolation structures.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If multiple conductive layers are stacked with specific grounding configurations, then filtering characteristics are improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improvefiltering characteristicsVSAvoidmanufacturing process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Multiple resonator structures are merged into a single integrated stacked assembly within one case. The first conductive layer, second conductive layer, and third conductive layer are combined with dielectric substances to form a unified resonant system. This merging approach improves filtering characteristics through controlled impedance and coupling while consolidating what could be multiple separate components into one manufacturable unit.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves a higher Q-factor and smaller size, enabling better filtering performance and reduced insertion loss, effectively functioning as a narrowband pass filter with improved shielding and wider filter bands.

Implementation Method 1

a stacked part formed inside the case by stacking a first conductive layer and a second conductive layer, wherein the first conductive layer is grounded to the first ground surface and the second conductive layer is separated from the first conductive layer without being grounded to the first ground surface

Methodology Applied
Scientific EffectLC resonance: Resonance

Implementation Method 2

An empty space inside the case can be filled with a dielectric substance. The dielectric substance can be a ceramic having a dielectric constant of 7.8

Methodology Applied
Scientific EffectDielectric: Dielectric

Data Source

PatentUS9520634B2Resonance device
Publication Date: 2016.12.13 INNERTRON INC
  • US9520634B2 patent drawing
  • US9520634B2 patent drawing
  • US9520634B2 patent drawing

AI summary

A resonance device is disclosed. The resonance device in accordance with an embodiment of the present invention includes: a case including a first ground surface and a second ground surface which face each other; a stacked part formed inside the case by stacking a first conductive layer and a second conductive layer, wherein the first conductive layer is grounded to the first ground surface and the second conductive layer is separated from the first conductive layer without being grounded to the first ground surface; and a transmission layer connecting the second conductive layer to the second ground surface.