Two-Layer Resonance Filter for Planar Integration

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Solution Overview

Problem

Conventional resonance filters for micrometer and millimeter wavelength ranges are large, heavy, expensive, and difficult to integrate into planar circuitry due to complex manufacturing techniques and high costs, while maintaining high quality and low loss factors.

Innovation Solution

A resonance filter design consisting of two layers, where one layer contains only resonance cavities and the other contains only coupling cavities, produced using cost-effective silicon technology methods, allowing for precise interconnection without sensitive positioning requirements and enabling integration into planar microelectronic circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional resonance filters are used for micrometer and millimeter wavelength ranges, then high quality and low loss factors are achieved, but the filters become large, heavy, expensive, and difficult to integrate into planar circuitry

Engineering Contradiction:
Improvefilter quality and low loss factorVSAvoidmanufacturing complexity and integration difficulty
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The filter structure is segmented into multiple layers (first layer with resonance cavities, second layer with coupling cavities) that can be manufactured separately and then assembled. This segmentation allows each layer to be optimized independently for its specific function while simplifying the overall manufacturing process and enabling integration into planar circuitry

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from conventional three-dimensional cavity filters to a planar multi-layer structure. By distributing resonance cavities in one layer and coupling cavities in another layer, the filter achieves compact integration suitable for planar microelectronic circuits while maintaining the necessary three-dimensional resonance characteristics

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If wet etching of multiple individual wafers is used to produce cavities, then cost-effective manufacture is achieved, but precise positioning of a large number of wafers is required

Engineering Contradiction:
Improvemanufacturing costVSAvoidwafer positioning precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The filter is divided into two main layers instead of requiring multiple individual wafers. The first layer contains all resonance cavities and the second layer contains all coupling cavities, reducing the number of components that need to be precisely positioned from five or more wafers to just two layers

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple cavity functions are merged into a two-layer structure where resonance cavities are formed in the first layer and coupling cavities are formed in the second layer. This merging eliminates the need for precise positioning of multiple separate wafers while maintaining all necessary filter functions

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If RIE method is used to produce cavities and coupling openings in the same wafer, then manufacturing steps are reduced, but high manufacturing costs are incurred

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidmanufacturing cost
Core Design Contradiction:
Device complexityVSEase of manufacture

Solution Approach 1:

The manufacturing process is segmented into two separate wet etching steps: one for producing resonance cavities in the first layer and another for producing coupling cavities in the second layer. This segmentation allows the use of cost-effective wet etching techniques instead of expensive RIE, while maintaining process simplicity through standardized manufacturing steps

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention changes the manufacturing parameter from RIE (reactive ion etching) to wet etching. This parameter change reduces manufacturing costs significantly while still achieving the required precision for cavity formation, as wet etching is a well-established, cost-effective technique in silicon technology

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a compact, high-quality filter with low losses and high Q-factor, suitable for micrometer to millimeter wavelength ranges, that can be effectively integrated into planar circuitry, reducing manufacturing costs and size while maintaining high performance.

Implementation Method 1

A frequently-used physical principle for producing filters is based on resonance; the corresponding filters are accordingly called resonance filters

Methodology Applied
Scientific EffectResonance: Resonance

Data Source

PatentUS8736403B2Resonance filter having low loss
Publication Date: 2014.05.27 AIRBUS DEFENCE & SPACE GMBH
  • US8736403B2 patent drawing
  • US8736403B2 patent drawing
  • US8736403B2 patent drawing

AI summary

The present disclosure provides example resonance filters and methods for making the same. The resonance filter includes a first layer having n adjacent resonance cavities, n being at least 2 and said cavities each being separated from one another by a partition wall. The resonance filter also includes a second layer having at least n−1 coupling cavities. The cavities in the first layer are formed as resonance cavities and those in the second layer are formed as (a) coupling cavity/cavities and are open on one side. The second layer is arranged on the first layer in such a way that the resonance cavities in the first layer are interconnected by the coupling cavity/cavities in the second layer. Further, the resonance filter is configured as a monolithic component.