Resonance Tag Hard Pad Prevents LC Circuit Reactivation
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Solution Overview
Problem
Conventional resonance tags can be inadvertently reactivated when bent, leading to unreliable deactivation and manufacturing complexities.
Innovation Solution
A resonance tag with a multi-layer structure and a hard pad that cuts the LC circuit into a permanent open-circuit when bent, preventing reactivation by using a hard pad to sever the wiring, ensuring reliable deactivation and easier manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional resonance tag uses a dielectric layer that can be broken down by high voltage to deactivate the LC circuit, then the tag can be deactivated, but the tag may be reactivated when bent several times
Solution Approach 1:
The invention divides the deactivation mechanism into two distinct parts: a dielectric layer that breaks down under high voltage to deactivate the LC circuit, and a hard pad that permanently damages the circuit when bent. This segmentation allows each component to perform its specific function without interfering with the other, ensuring both deactivation reliability and prevention of reactivation.
Solution Approach 2:
The hard pad is positioned to perform preliminary anti-action by permanently damaging the circuit trace when the tag is bent, preventing any future reactivation. This preliminary damage ensures that even if the dielectric layer were to restore conductivity, the physical damage to the circuit trace would prevent functional reactivation.
2Reliability
If a resonance tag uses an abrasive pad to prevent reactivation by abrading the circuit layer, then reactivation is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
Instead of using an abrasive pad that requires precise positioning and complex manufacturing, the invention applies local quality by making only the specific area where the circuit trace is located have enhanced mechanical strength through the hard pad. This localized approach prevents reactivation at the critical point without requiring complex structures elsewhere in the tag.
Solution Approach 2:
The hard pad is designed as a simple, inexpensive component that can be easily integrated into the tag structure. Rather than using a complex abrasive pad system, the hard pad provides sufficient permanent damage to the circuit trace through simple mechanical bending, achieving the desired functionality with minimal complexity and cost.
3Ease of manufacture
If the resonance tag uses a simple dielectric layer without additional protective structures, then the manufacturing process is simple, but the tag can be reactivated after bending
Solution Approach 1:
The invention merges two functions into a single integrated structure: the dielectric layer provides electrical insulation and breakdown for deactivation, while the hard pad provides mechanical damage prevention for permanent deactivation. By combining these functions in a unified structure rather than separate components, the tag achieves both manufacturing simplicity and reliable permanent deactivation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more reliable and easily manufactured resonance tag that effectively prevents reactivation, enhancing the security and durability of the tag by ensuring a permanent open-circuit upon bending.
Implementation Method 1
When the product passes through a detector, the resonance tag receives an electromagnetic wave from the detector, thereby causing the tag to resonate to reflect an electromagnetic wave with the same frequency
Implementation Method 2
The resonance tag is inactivated by appling a high voltage generated when the resonance tag is given a pulse wave or Joule heat accompanied by the high voltage
Data Source
Figure 1
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Figure 4~5
AI summary
A resonance tag includes a dielectric layer, a first circuit layer, a second circuit layer and a hard pad. The first circuit layer is formed on one surface of the dielectric layer, and the first circuit layer has a first electrode pattern and a coil. A second circuit layer is formed on the other surface of the dielectric layer, and the second circuit layer has a second electrode pattern and a wiring. A hard pad is formed on the second circuit layer and corresponding to the wiring of the second circuit layer, and then an edge of the hard pad is beyond the edge of the wiring.