Resonant Cavity Microstrip Filter for High Power Miniaturization
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Solution Overview
Problem
Current RF filters, particularly metal cavity filters, face challenges in miniaturization while maintaining high power capacity, as they are either too large or have limited power handling due to material heat resistance and copper coating constraints, failing to meet the requirements of next-generation mobile communication systems.
Innovation Solution
A filter design incorporating a resonant cavity component with multiple parallel cavities and a microstrip filtering component on a dielectric substrate, where connecting pieces match impedance, allowing high-power signals to travel through the resonant cavity, preventing breakdown and ensuring high power capacity while minimizing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If metal cavity filters are used to achieve high power capacity, then power handling capability is improved, but device size becomes large
Solution Approach 1:
The filter is divided into multiple resonant cavities (first resonant cavity, second resonant cavity, third resonant cavity) that work together to achieve the required power handling capability while reducing the size of each individual cavity. The segmentation allows the system to distribute the power handling load across multiple smaller units.
Solution Approach 2:
The patent employs a nested structure where resonant cavities are arranged in a compact configuration, with cavities positioned to utilize shared walls and overlapping spatial arrangements. This nesting approach maximizes the power handling capability within a minimized overall device volume.
2Volume of stationary object
If non-metal cavity filters are used to minimize size, then device size is reduced, but power handling capability becomes limited
Solution Approach 1:
The patent uses composite material structures in the resonant cavities, combining different materials with complementary properties. The cavity walls utilize materials that provide both mechanical strength for compact design and electromagnetic properties for high power handling. This composite approach enables small size while maintaining high power capacity.
3Volume of stationary object
If suspended microstrip filters are used to reduce size, then device size is minimized, but power capacity is limited by material heat resistance and copper coating
Solution Approach 1:
The patent replaces the traditional suspended microstrip structure with a resonant cavity structure that uses electromagnetic field confinement rather than relying on copper coating heat dissipation. This substitution eliminates the power capacity limitation imposed by material heat resistance and copper coating thickness, allowing high power handling in a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high-power transmission with minimized size, fulfilling RF insertion loss and suppression indexes, and ensuring the power capacity index of the filter, addressing the limitations of existing filters.
Implementation Method 1
The resonant cavity component 100 includes at least two resonant cavities 101 connected in parallel, and each resonant cavity 101 is provided with a resonator 102
Implementation Method 2
the connecting piece 401 matches and connects one end of the microstrip 201 to the resonator 102 on one resonant cavity 101; and the connecting piece 402 matches and connects the other end of the microstrip 201 to the resonator 102 on another resonant cavity
Data Source
AI summary
Embodiments of the present invention provide a filter, a receiver, a transmitter, and a transceiver. The filter includes a resonant cavity component, a microstrip filtering component, and two connecting pieces, where the resonant cavity component includes at least two resonant cavities connected in parallel, each resonant cavity is provided with a resonator and a tuning screw, the microstrip filtering component includes a dielectric substrate and a microstrip positioned on the dielectric substrate, one of the connecting pieces matches and connects one end of the microstrip to the resonator on one resonant cavity, the other connecting piece matches and connects the other end of the microstrip to the resonator on another resonant cavity, and impedance of the resonant cavity component is less than impedance of the microstrip filtering component.