Resonant Cavity Power Combining for Fault-Tolerant Solid-State Amplifiers
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Solution Overview
Problem
Conventional systems for combining the outputs of multiple high-power transistors are complex, costly, and unreliable, often requiring extensive cabling and leading to system shutdown upon transistor failure.
Innovation Solution
A resonant cavity combined solid-state amplifier system that directly combines the power of multiple transistors using impedance matching networks and a resonant cavity, incorporating features like transmission lines, coupling loops, and DC power chokes to ensure operation continuity even with transistor failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional microwave power combiners are used to combine outputs of multiple high-power transistors, then the required power level is achieved, but the system complexity and cost increase significantly due to extensive cabling requirements
Solution Approach 1:
The patent merges multiple transistor outputs directly into a single resonant cavity structure, eliminating the need for separate microwave cables for each transistor. The resonant cavity serves as a common combining structure where all transistor outputs are coupled through shared coupling structures, reducing cabling complexity while maintaining the required combined power output.
Solution Approach 2:
The resonant cavity acts as an intermediary structure that receives power from multiple transistors through coupling loops and combines them efficiently. This intermediary structure eliminates the need for complex external combiner cabling by providing an integrated combining mechanism within the cavity itself.
2Power
If conventional amplifier modules with individual transistors are used, then the required power level is achieved, but reliability decreases due to system shutdown upon transistor failure
Solution Approach 1:
The patent incorporates isolation components such as DC power chokes and coupling structures that electrically isolate individual transistors from the common resonant cavity. This isolation provides beforehand protection against failure propagation, ensuring that if one transistor fails, the others remain operational and can continue to drive the cavity, maintaining system reliability.
3Power
If multiple individual amplifier modules are used to achieve high power output, then the required power level is achieved, but manufacturing and installation costs increase due to extensive cabling
Solution Approach 1:
The patent merges multiple transistor outputs into a single integrated resonant cavity structure, eliminating the need for separate external combiner assemblies and extensive interconnecting cabling. This integration simplifies both manufacturing and installation processes while achieving the required high power output.
4Power
If conventional power combining systems are used, then the required power level is achieved, but the quantity of cables and cooling lines increases significantly
Solution Approach 1:
The patent merges multiple transistor outputs into a single resonant cavity structure, eliminating the need for separate microwave cables for each transistor. The resonant cavity serves as a common combining structure where all transistor outputs are coupled through shared coupling structures, significantly reducing the quantity of cabling required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides a less complex, more reliable high-power output with reduced cabling and maintains operation even if one or more transistors fail, offering efficient power combination and redundancy.
Implementation Method 1
combining the power of a plurality of high-power transistors in a resonant cavity to provide a combined high-power output
Implementation Method 2
Each output impedance matching network includes a coupling loop configured to electromagnetically couple power into the resonant cavity
Implementation Method 3
Each output impedance matching network includes at least one transmission line configured to transform impedance to an input impedance of the resonant cavity
Implementation Method 4
The system may include a DC power choke coupled between a DC bus and each of the plurality of output impedance networks configured to isolate a failed transistor from the DC bus
Data Source
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AI summary
A resonant cavity combined solid-state amplifier system including a resonant cavity having at least one output port coupled to a high-power transmission line. A plurality of high-power transistors are each configured to generate a variable amount of power input directly into the resonant cavity. The plurality of high-power transistors may be configured such that a failure of one or more of the plurality of high-power transistors does not substantially impede operation of the resonant cavity. A plurality of output impedance matching networks each coupled to one of the plurality of high-power transistors and extending into the resonant cavity are configured to match an impedance of each transistor to an impedance of the resonant cavity and configured to electromagnetically couple power from each of the plurality of high-power transistors into the resonant cavity to provide a combined high-power output to the high-power transmission line.