Resonant Element Columnar Via Electrodes Dielectric Strength
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Solution Overview
Problem
Conventional resonant elements with wall-shaped electrodes inside a dielectric have reduced dielectric proportion and strength due to the lower strength of conductive paste electrodes compared to the dielectric, leading to compromised performance.
Innovation Solution
The resonant element design incorporates columnar via electrodes extending in the same direction as the first via electrode, connecting plane electrodes to form inductors and a capacitor, increasing the dielectric proportion and enhancing the strength of the resonant element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wall-shaped electrodes with width similar to via hole are used, then the resonant element achieves compact size, but the dielectric proportion decreases and strength is lowered
Solution Approach 1:
The inductor is segmented into multiple via electrodes (first via electrode, second via electrode, third via electrode) arranged in a specific pattern. This segmentation allows the electrode structure to achieve the required inductance value while maintaining a compact footprint and preserving dielectric proportion, as the via electrodes are distributed rather than forming a continuous wall structure.
Solution Approach 2:
Different regions of the resonant element are assigned different functions: via electrodes are placed at specific locations to form inductors, while plane electrodes are positioned to form capacitors. This local differentiation optimizes the electrical performance in each region while maintaining overall compactness and structural integrity.
2Reliability
If wall-shaped electrodes are used to form inductors, then the resonant element achieves required inductance values, but the dielectric proportion decreases
Solution Approach 1:
The inductor structure is divided into discrete via electrodes rather than using continuous wall-shaped electrodes. This segmentation reduces the total volume occupied by electrodes, thereby increasing the dielectric proportion while still achieving the required inductance through the strategic arrangement and connectivity of the via electrodes.
Solution Approach 2:
The electrode arrangement utilizes three-dimensional space within the dielectric substrate. Via electrodes are positioned at different depths and planar positions, creating inductance through vertical and horizontal connectivity patterns. This multi-dimensional arrangement achieves the required inductance values without requiring large planar areas, thus preserving dielectric proportion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the strength and Q value of the resonant element by increasing the dielectric proportion and reducing resistance components, allowing for better connection with other circuit elements and improved performance.
Implementation Method 1
a first via electrode defining a first inductor, a second inductor, and a third inductor
Implementation Method 2
The third plane electrode defines a first capacitor together with the second plane electrode
Data Source
AI summary
A resonant element includes first, second, and third plane electrodes, a first via electrode defining a first inductor, a second inductor, and a third inductor. The first via electrode connects the first plane electrode and the second plane electrode, and each of the second inductor and the third inductor connects the first plane electrode and the third plane electrode. The third plane electrode defines a first capacitor together with the second plane electrode, the second inductor includes second via electrodes, and the third inductor includes third via electrodes. Each of the second via electrodes and the third via electrodes is a columnar conductor extending in the extending direction of the first via electrode.