Resonant Inductor Tuning Circuit for Substrate Processing
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Solution Overview
Problem
Conventional substrate processing systems face challenges in removing native or process-generated oxides and defects, which lead to increased contact resistance, especially in smaller features, due to limitations in tuning resonator inductor circuits that can only accommodate a single configuration, restricting the use of multiple gas combinations and pressure regimes.
Innovation Solution
A substrate processing system with a resonant inductor tuning circuit that allows dynamic adjustment of the resonator coil's length by selecting different RF feed points, enabling the use of multiple gas combinations and pressure regimes without the need for manual re-tuning, thereby effectively removing native oxides and defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed position resonator inductor circuit is used, then the system structure is simple, but the system can only be tuned to a single position for a given configuration, limiting adaptability
Solution Approach 1:
The resonator inductor circuit is transformed from a fixed configuration to a dynamically adjustable one by introducing a variable capacitor that can be tuned during operation. This allows the resonant frequency to be changed without altering the physical structure of the coil, enabling the system to adapt to different process requirements while maintaining circuit simplicity.
Solution Approach 2:
The invention changes the electrical parameter (capacitance) of the resonant circuit rather than its physical geometry. By varying the capacitance value through a variable capacitor, the resonant frequency can be adjusted to match different process gas combinations and pressure regimes, achieving versatility without increasing structural complexity.
2Productivity
If manual re-tuning is required for different gas combinations and pressure regimes, then the resonator can be optimized for each condition, but the process time and operational complexity increase
Solution Approach 1:
The system enables operators to perform self-tuning by simply adjusting the variable capacitor knob without requiring external assistance or complex procedures. The resonant frequency automatically adjusts to match the process conditions, allowing quick transitions between different gas combinations and pressure regimes while maintaining ease of operation.
Solution Approach 2:
The variable capacitor allows real-time adjustment of the resonant frequency during different process steps. This dynamic tuning capability eliminates the need for manual reconfiguration or system shutdowns when changing process parameters, thereby improving productivity while keeping the operation simple through a single control element.
3Adaptability or versatility
If the resonator coil length is fixed, then the manufacturing is simple, but the system cannot adapt to multiple gas combinations and pressure regimes
Solution Approach 1:
Instead of manufacturing multiple resonator coils with different lengths for different process conditions, the invention maintains a single fixed coil and changes the electrical parameter (capacitance) to adapt to various gas combinations and pressure regimes. This approach preserves manufacturing simplicity while achieving the desired versatility.
Solution Approach 2:
The fixed resonator coil combined with a variable capacitor creates a universal circuit design that can handle multiple gas combinations and pressure regimes. The same physical coil serves all process conditions by relying on electrical parameter adjustment rather than requiring multiple specialized components, thus maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient removal of native oxides and defects, reducing contact resistance and allowing for flexible processing of substrates with different gas treatments in a single chamber, improving the cleaning efficiency and adaptability of the system.
Implementation Method 1
a resonator coil disposed proximate the plasma forming zone
Implementation Method 2
a resonant inductor tuning circuit configured to vary a length of the resonator coil
Data Source
AI summary
Apparatus and methods for processing substrates are disclosed. In some embodiments, a substrate processing system includes: a process chamber defining an interior volume for receiving a substrate and having a plasma forming zone, a substrate support positioned within the interior volume, a resonator coil disposed proximate the plasma forming zone, and a resonant inductor tuning circuit configured to vary an RF feed point location along the resonator coil. A method of operating a substrate processing system, according to embodiments, includes: transferring a substrate to a substrate support disposed within an interior volume of a processing chamber, the interior volume having a plasma forming zone, and operating a resonant inductor tuning circuit to couple an RF power source to a first RF feed point of a plurality of RF feed points along a resonator coil disposed proximate the plasma forming zone.