Resonant Pressure Sensor Projection Structure
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Solution Overview
Problem
Resonant pressure sensors face challenges in improving sensitivity due to the difficulty in disposing a resonator apart from the neutral plane, especially when the diaphragm becomes thinner, leading to reduced sensitivity and pressure capacity.
Innovation Solution
The resonant pressure sensor design includes a diaphragm with a projection and a resonator disposed between the top of the projection and the intermediate level of the substrate, allowing the resonator to be positioned apart from the neutral plane, thereby enhancing sensitivity and pressure capacity while maintaining a thinner diaphragm.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the diaphragm is made thinner to improve sensitivity, then the sensitivity of the sensor is improved, but it becomes difficult to dispose the resonator apart from the neutral plane
Solution Approach 1:
The patent introduces a projection structure that extends in the thickness direction (third dimension) of the diaphragm. By placing the resonator on this projection, the design moves the resonator away from the neutral plane in the thickness direction, enabling it to detect deformation effectively even when the diaphragm is made thinner. This dimensional approach resolves the contradiction by providing a vertical separation between the resonator and the neutral plane.
Solution Approach 2:
The projection acts as an intermediary structure between the diaphragm and the resonator. It provides a platform that elevates the resonator above the neutral plane, allowing the resonator to detect diaphragm deformation while being positioned apart from the neutral plane. This intermediary structure enables both thin diaphragm design and effective resonator placement.
2Measurement precision
If the diaphragm is made thinner by polishing and etching, then the sensitivity is improved, but the resonator cannot be disposed apart from the neutral plane
Solution Approach 1:
The projection structure utilizes the thickness direction to create vertical separation between the resonator and the neutral plane. This allows the resonator to be positioned at a different height (in the third dimension) rather than requiring precise lateral positioning, thereby resolving the manufacturing precision issue while maintaining sensitivity improvement from the thin diaphragm.
Solution Approach 2:
The projection is formed as a pre-existing structure on the diaphragm before the resonator is placed or integrated. This preliminary structure provides a predetermined position for the resonator, making the overall manufacturing process more precise and easier to control, as the resonator's position is determined by the projection geometry rather than requiring complex alignment procedures.
3Measurement precision
If the diaphragm is made thinner, then sensitivity is improved, but pressure capacity is reduced
Solution Approach 1:
The projection creates a local thickened region on the diaphragm where the resonator is positioned. This local quality change allows the diaphragm to be thin in most areas (maintaining sensitivity) while having a locally reinforced region (the projection) that provides structural support and improves pressure capacity. The projection acts as a stress concentration point that prevents overall diaphragm failure under pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the sensitivity and pressure capacity of the resonant pressure sensor by allowing the resonator to detect micro-pressure effectively, even when the diaphragm is thinner, and reduces chip size, while maintaining high accuracy and stability.
Implementation Method 1
resonant pressure sensor
Data Source
AI summary
A resonant pressure sensor includes a first substrate and a resonator. The first substrate includes a diaphragm and a projection disposed on the diaphragm. The resonator is disposed in the first substrate, a part of the resonator being included in the projection, and the resonator being disposed between a top of the projection and an intermediate level of the first substrate. The first substrate is an SOI substrate in which a silicon dioxide layer is inserted between a silicon substrate and a superficial silicon layer. The intermediate level of the first substrate is disposed in the silicon substrate, and the resonator is disposed in the projection included in the superficial silicon layer.