Resonator Antenna Meta-Material Miniaturization
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Solution Overview
Problem
Existing resonator antennas require high dielectric constant and magnetic permeability substrates to miniaturize, leading to increased manufacturing costs, and techniques involving meta-materials with conductor vias also increase costs.
Innovation Solution
A resonator antenna design that uses a first and second conductor with a first opening, an interconnect connected to the first conductor, and a chip inductor in a third conductor island, eliminating the need for conductor vias and allowing miniaturization using meta-materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a substrate material with extremely high dielectric constant and magnetic permeability is used to reduce resonator antenna size, then the antenna size is reduced, but the manufacturing cost increases
Solution Approach 1:
The patent changes the electromagnetic parameters of the substrate by introducing a meta-material structure with periodically arranged conductor patterns. This artificial structure creates an effective dielectric constant and magnetic permeability that are different from the base substrate, allowing size reduction without requiring expensive high-permeability materials. The meta-material achieves the desired electromagnetic characteristics through geometric configuration rather than material composition.
Solution Approach 2:
The patent creates a composite structure combining a base substrate with a meta-material layer containing periodically arranged conductor patterns. This composite approach allows the system to achieve effective high dielectric constant and magnetic permeability properties through the combination of ordinary materials with a structured pattern, avoiding the need for expensive specialized materials while maintaining miniaturization benefits.
2Volume of moving object
If a meta-material with conductor vias is used to miniaturize the resonator antenna, then the antenna size is reduced, but the manufacturing cost increases
Solution Approach 1:
The patent removes the conductor via component from the meta-material structure. Instead of using vertical vias to connect conductor patches to the ground plane, the invention uses surface-mounted interconnects that lie flat on the substrate surface. This extraction of the via element simplifies the manufacturing process by eliminating the need for complex via formation steps while maintaining the miniaturization effect of the meta-material.
Solution Approach 2:
The patent replaces expensive and complex conductor vias with simpler, cheaper surface-mounted interconnects. The interconnects are formed using standard PCB trace techniques rather than requiring via drilling and plating processes, significantly reducing manufacturing complexity and cost while achieving the same electrical connection function.
3Reliability
If conductor vias are formed to connect the conductor patch to the conductor plane in a meta-material structure, then the antenna structure is complete, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent replaces the mechanical via structure (vertical conductive paths through the substrate) with a planar interconnect system. The interconnects are formed as surface traces using standard PCB fabrication techniques, substituting the three-dimensional via formation process with a two-dimensional trace routing approach that is simpler and more cost-effective to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design simplifies the structure, reduces manufacturing costs, and achieves miniaturization without the need for conductor vias, while maintaining effective electromagnetic wave propagation characteristics.
Implementation Method 1
Resonator antennas such as a patch antenna and a wire antenna operate when the element size thereof is equivalent to wavelength of 1⁄2 of an electromagnetic wave propagating through a medium such as a dielectric
Implementation Method 2
a meta-material has been proposed in which the dispersion relationship of electromagnetic waves propagating through in a structure is artificially controlled by periodically arranging conductor patterns or conductor structures
Data Source
AI summary
A resonator antenna includes a first conductor pattern as a first conductor, a second conductor pattern as a second conductor, a plurality of first openings, a plurality of interconnects, and a power feed line. The first conductor pattern has, for example, a sheet shape. The second conductor pattern has, for example, a sheet shape, and at least a portion thereof (which, however, may be nearly the entirety thereof) faces the first conductor pattern. A plurality of first openings is provided in the first conductor pattern. The interconnect is provided in each of a plurality of first openings, and one end thereof is connected to the first conductor pattern. The power feed line is connected to the first conductor pattern. Unit cells including the first opening and the interconnect are repeatedly, for example, periodically disposed.