Resonator Base Step Design for Diffusion Bonding Short-Circuit Prevention
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Solution Overview
Problem
In the process of diffusion bonding quartz crystal substrates, metal atoms are often repelled and attach to unintended locations, leading to short-circuiting of interconnects, which cannot be completely prevented by using masks during sputtering.
Innovation Solution
A resonator device design that includes a base with a resonator element mount surface, interconnects, a bonding surface, and a step between these surfaces, where the interconnects are positioned on the mount surface to reduce contact with the bonding metal film, thereby minimizing short-circuiting through the use of a step formed on the base substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a mask is used during sputtering to prevent metal atom attachment, then the attachment of metal atoms to unintended locations is reduced to a certain extent, but metal atoms can still pass around the mask to a space immediately below the mask, and this problem cannot be securely prevented
Solution Approach 1:
The patent applies preliminary action by forming a protective coating layer on the substrate surface before the sputtering process. This coating is deposited in advance to create a barrier that prevents metal atoms from reaching and attaching to unintended locations during the bonding metal film deposition, including areas that would otherwise be exposed despite mask usage
Solution Approach 2:
The patent uses an intermediary approach by introducing a protective coating layer as a mediator between the sputtering process and the substrate. This coating acts as a sacrificial barrier that intercepts metal atoms during deposition, preventing them from reaching the substrate surface and causing short-circuits, while allowing the bonding process to proceed normally
2Strength
If diffusion bonding is used to bond quartz crystal substrates, then strong bonding is achieved, but metal atoms are repelled during deposition and attach to unintended locations on the substrate surface, causing interconnect short-circuits
Solution Approach 1:
The patent applies segmentation by dividing the substrate surface into distinct functional zones: areas requiring metal atom attachment for bonding and areas requiring protection for interconnects. This is achieved through selective coating deposition that creates spatially differentiated protection, allowing strong bonding in designated areas while preventing metal atom attachment to interconnects in protected areas
Solution Approach 2:
The patent implements local quality by providing non-uniform protection across the substrate surface. The protective coating is applied selectively to specific regions where interconnects are located, while leaving other regions exposed for proper bonding. This creates locally differentiated properties where some areas are protected from metal atoms and others are not, based on their functional requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces short-circuiting of interconnects during the diffusion bonding process, enhancing the reliability and stability of the resonator device by separating the metal film deposited on the bonding surface from the interconnects.
Implementation Method 1
a conductive bonding member bonding the base to the cover
Implementation Method 2
deposition of the bonding metal film on the substrate by sputtering
Data Source
AI summary
A resonator device includes a base, a resonator element attached to the base, a cover accommodating the resonator element between the base and the cover, and a conductive bonding member positioned between the base and the cover and bonding the base to the cover. The base includes a resonator element mount surface on which the resonator element is attached, a first interconnect and a second interconnect that are arranged on the resonator element mount surface and that are electrically coupled to the resonator element, a bonding surface bonded to the cover through the bonding member, and a step between the resonator element mount surface and the bonding surface.