Resonator Coupling Wire Layout for Collective Frequency Adjustment

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Solution Overview

Problem

Conventional methods for manufacturing resonance devices using MEMS technology require time-consuming frequency adjustments for each device, and attempts to improve productivity through collective frequency adjustment on a wafer before singulation often result in defective products due to deformation of coupling wires during the division process, leading to short circuits.

Innovation Solution

A resonance device and manufacturing method that includes a first substrate with a resonator and a second substrate bonded to it, featuring power supply and ground terminals, inner wires, and coupling wires that connect upper electrodes, allowing for collective energization and frequency adjustment without deformation issues during singulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If coupling wires are continuously formed to enable collective frequency adjustment before singulation, then productivity is improved, but the coupling wires deform during division causing short circuits

Engineering Contradiction:
Improvefrequency adjustment speedVSAvoidproduct defect rate
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The coupling wire is divided into multiple segments with gaps between them, allowing the wire to be electrically disconnected during singulation while maintaining electrical connection during collective frequency adjustment. This segmentation resolves the contradiction by enabling the wire to serve different functions at different stages: continuous for collective adjustment, disconnected for individual device operation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The coupling wire is formed in advance before singulation to enable collective frequency adjustment. The wire is preliminarily positioned to connect power supply terminals across multiple devices, allowing frequency adjustment to be performed on all devices simultaneously before they are divided into individual units.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If frequency adjustment is performed on each individual device, then reliability is maintained, but productivity decreases due to time consumption

Engineering Contradiction:
Improvefrequency adjustment accuracyVSAvoidmanufacturing cycle time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

Multiple frequency adjustment operations that would normally be performed individually on each device are merged into a single collective operation. By connecting power supply terminals of multiple devices through coupling wires, the frequency adjustment signal is applied simultaneously to all devices, reducing total adjustment time while maintaining accuracy through uniform signal distribution.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient collective energization and frequency adjustment of multiple resonance devices, reducing the risk of short circuits and improving productivity by maintaining the integrity of coupling wires during the division process.

Implementation Method 1

providing a piezoelectric thin film on the first metal layer

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

a frequency adjustment step of adjusting a resonant frequency by applying a predetermined drive voltage to a resonator

Methodology Applied
Scientific EffectResonance: Resonance

Data Source

PatentUS20230361740A1Resonance device, collective board, and manufacturing method for resonance device
Publication Date: 2023.11.09 MURATA MFG CO LTD
  • US20230361740A1 patent drawing
  • US20230361740A1 patent drawing
  • US20230361740A1 patent drawing

AI summary

A resonance device is provided that includes a first substrate including a resonator; and a second substrate bonded to the first substrate. The second substrate includes a first power supply terminal electrically connected to an upper electrode of the resonator, and a ground terminal electrically connected to a lower electrode of the resonator. The first substrate includes a first inner wire that electrically connects the upper electrode to the first power supply terminal, and a first coupling wire connected to the first inner wire and having an end portion located at an outer edge of the first substrate.