Silicon-Packaged Resonator Heating for Uniform Temperature Control
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Solution Overview
Problem
Existing resonator devices face challenges in uniformly distributing heat from a heat generating element to the resonator element, leading to temperature differences and reduced accuracy of oscillation frequency due to non-uniform heating.
Innovation Solution
A resonator device design incorporating a first package made of single crystal silicon with a heater bonded to it, enclosed within a second package, where the first package includes a base substrate with a temperature sensor and a lid, ensuring efficient heat transfer and temperature uniformity through a configuration that minimizes thermal conductivity variations and maintains a constant temperature environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat generating element is coupled to one end of the resonator element, then the resonator element can be heated, but the heat is not uniformly transferred and temperature difference is generated in the resonator element
Solution Approach 1:
The patent introduces a heat distribution layer as an intermediary between the heat generating element and the resonator element. This layer receives heat from the heat generating element and distributes it uniformly across the resonator element, preventing temperature differences and improving oscillation frequency accuracy.
Solution Approach 2:
The heating system is segmented into distinct functional layers: a heat generating element, a heat distribution layer, and a resonator element. This segmentation allows each layer to perform its specific function optimally, with the heat distribution layer specifically designed to evenly distribute thermal energy.
2Reliability
If the resonator element is heated to stabilize resonance frequency, then frequency stability is improved, but temperature uniformity across the resonator element deteriorates
Solution Approach 1:
The heat distribution layer acts as a mediator that receives concentrated heat from the heat generating element and redistributes it uniformly across the resonator element. This ensures the entire resonator element reaches a stable, uniform temperature, improving resonance frequency stability without creating temperature gradients.
Solution Approach 2:
The patent changes the thermal parameters of the system by introducing a layer with specific thermal conductivity properties. This layer modifies the heat flow pattern, transforming concentrated heat input into uniform thermal distribution across the resonator element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved temperature control and enhanced accuracy of oscillation frequency by preventing temperature unevenness in the resonator element and reducing external temperature variations, thereby stabilizing the resonance frequency.
Implementation Method 1
a heater (20) that is bonded to the first package (31)... heat of the heater (20) is transferred to the resonator element (60)
Implementation Method 2
a base substrate (32)... that contains single crystal silicon... heat of the heater (20) is transferred to the resonator element (60)
Implementation Method 3
an integrated circuit (40) that is provided on the first surface (32a) or the second surface (32b) and that includes a temperature sensor (46)
Implementation Method 4
a stable oscillation frequency is output... resonance frequency is stabilized
Data Source
AI summary
A resonator device includes: a resonator element; a first package accommodating the resonator element; a heater bonded to the first package; and a second package accommodating the first package and the heater. The first package includes: a base substrate that has a first surface on which the resonator element is disposed and a second surface in a front-back relation with the first surface, and that contains single crystal silicon; an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor; and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.