Resonator Package Layout for Adhesive Spread and Frequency Stability
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Solution Overview
Problem
Existing temperature-compensated oscillators face reduced insulation properties and frequency stability due to adhesive spreading, which increases the adhesive area and degrades the output oscillation frequency accuracy.
Innovation Solution
A resonator device with a double-sealed structure featuring a container and base substrate configuration, where the container is bonded via a first adhesive to a recess and a wiring pattern, controlling the adhesive area and enhancing insulation by creating a space between the container and the base substrate, thereby maintaining constant adhesive area and improving frequency accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the first container is fixed to the fixing portion with an adhesive, then the container is securely mounted, but the adhesive spreads and increases the adhesive area which reduces insulation property and degrades frequency stability
Solution Approach 1:
The base substrate is divided into distinct functional regions: a mounting region for secure adhesive bonding and a recessed region for thermal insulation. This segmentation allows the adhesive to be confined to the mounting region while the recessed region maintains thermal isolation of the resonator element, thus resolving the contradiction between mounting strength and frequency stability.
Solution Approach 2:
Different regions of the base substrate are given different properties: the mounting region has high adhesive bonding capability while the recessed region provides thermal insulation. This local differentiation allows the adhesive to perform its mounting function without compromising the insulation property needed for frequency stability.
2Strength
If the adhesive area is increased to ensure secure mounting, then the mounting strength is improved, but the insulation property is reduced and frequency accuracy is degraded
Solution Approach 1:
The base substrate is segmented into a mounting region with larger adhesive area for secure bonding and a recessed region that maintains thermal insulation. This segmentation enables the adhesive area to be increased for mounting strength without allowing the adhesive to spread into the insulation region, thus preserving frequency accuracy.
3Device complexity
If the container is directly bonded to the base substrate, then the mounting is simplified, but heat transfer to the resonator element increases and frequency stability is reduced
Solution Approach 1:
The base substrate is segmented to include a recessed region that creates thermal isolation between the container and the base substrate. This segmentation maintains relatively simple mounting structure while the recessed region prevents direct heat transfer path to the resonator element, thus preserving frequency stability.
Solution Approach 2:
The recessed region acts as an intermediary thermal barrier between the container and the base substrate. This intermediary structure prevents direct heat conduction from the base substrate to the resonator element, reducing heat transfer while maintaining a relatively simple overall mounting structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances insulation properties and maintains frequency accuracy by controlling the adhesive area and heat transfer, resulting in a resonator device with improved stability and precision.
Implementation Method 1
a first bonding portion overlapping the container in plan view and bonded to the container via a first adhesive
Implementation Method 2
a recess overlapping the container in plan view and forming a space with the container
Data Source
AI summary
A resonator device includes a container accommodating a resonator component and a base substrate on which the container is mounted. The base substrate includes a recess overlapping the container in plan view and forming a space with the container, a first bonding portion overlapping the container in plan view and bonded to the container via a first adhesive, and a first wiring pattern provided such that the first bonding portion is disposed between the recess and the first wiring pattern in plan view.