Piezoelectric Resonator Temperature Sensor Mounting Alignment
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Solution Overview
Problem
The existing piezoelectric resonator devices face positional deviations during the mounting of temperature sensor units due to inaccuracies in applying conductive bonding materials, which affects the bonding strength and reliability of the sensor unit's placement.
Innovation Solution
The design includes exposed temperature sensor electrode pads within the second cavity with specific geometric configurations, such as rectangular shapes and protrusions, to ensure the conductive bonding material covers the entire surface, allowing for accurate and strong bonding regardless of application position, and includes cut-out or slit portions to control the flow direction of the bonding material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conductive bonding material is applied to thermistor element mounting pads, then the thermistor element can be bonded to the base, but positional deviation in application results in positional deviation in mounting the thermistor element
Solution Approach 1:
The bonding material is configured to self-align and self-center on the mounting pads through its geometric relationship (D1/D2 ratio and coverage area), eliminating the need for precise external positioning during application. The material automatically distributes itself to cover the entire pad surface, ensuring accurate mounting position without requiring high-precision application processes.
Solution Approach 2:
The invention changes the geometric parameters of the bonding material configuration, specifically the ratio D1/D2 (where D1 is the diameter of the bonding material and D2 is the diameter of the mounting pad) to be within 0.5 to 2.0, and ensures the bonding material covers the entire pad surface. This parameter optimization enables the material to naturally achieve proper alignment and centering during bonding.
2Volume of moving object
If the piezoelectric resonator device is downsized, then the device becomes more compact and suitable for modern applications, but the mounting accuracy of temperature sensor units becomes more difficult to maintain
Solution Approach 1:
The bonding material's geometric configuration enables automatic self-alignment and self-centering on the temperature sensor mounting pads, eliminating the need for complex external positioning systems. This self-service mechanism ensures consistent mounting accuracy even in the constrained space of downsized devices, maintaining precision without requiring additional complex components.
Solution Approach 2:
By optimizing the geometric parameters of the bonding material (D1/D2 ratio between 0.5 and 2.0) and ensuring complete coverage of the mounting pad surface, the invention achieves reliable positioning accuracy in compact device configurations. This parameter control compensates for the reduced margins for error inherent in downsized devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration eliminates positional deviations and enhances the bonding strength of the temperature sensor unit, ensuring reliable mounting and improved performance by ensuring the conductive bonding material spreads correctly over the electrode pads.
Implementation Method 1
a piezoelectric resonator device is an electronic device in which are hermetically sealed driving electrodes of a piezoelectric resonator plate that cause piezoelectric resonance
Implementation Method 2
The conductive bonding material is formed so as to cover an entire surface of the exposed electrodes including the temperature sensor electrode pads to which the temperature sensor unit is bonded
Data Source
AI summary
A deviation in mounting a temperature sensor unit is eliminated. In a second cavity 47 for mounting a temperature sensor unit 3 of a base 4, exposed electrodes 6 that intersect at least an internal wall surface 474 of a second wall portion 45 are formed so as to be exposed within the second cavity 47. The exposed electrodes 6 include a pair of temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded via a solder 13. The solder 13 is formed so as to cover an entire surface of the exposed electrodes 6 including the temperature sensor electrode pads 621 and 622 to which the temperature sensor unit 3 is bonded.