Piezoelectric Resonator Thermal Coupling for Stable Oscillation
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Solution Overview
Problem
In piezoelectric resonator devices, temperature differences between the resonator and heating elements can lead to unstable oscillation frequencies due to separate placement, affecting the accuracy of temperature adjustment in oven-controlled crystal oscillators.
Innovation Solution
A piezoelectric resonator device with a three-ply structured resonator hermetically sealing a vibrating part, where at least one main surface of the resonator is thermally coupled to a heating element, with an oscillation IC optionally mounted, ensuring efficient heating and rapid temperature increase of the core section.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the piezoelectric resonator and heating element are disposed separated from each other, then the device structure is simpler and easier to manufacture, but temperature uniformity deteriorates and frequency stability worsens
Solution Approach 1:
The heating element is integrated directly into the piezoelectric resonator structure, with the heating electrode formed on the same substrate as the resonator electrodes. This merging eliminates the need for separate heating element placement and bonding, simplifying manufacturing while ensuring perfect thermal contact and temperature uniformity across the resonator, thereby maintaining high frequency stability.
2Ease of operation
If the piezoelectric resonator and heating element are disposed separated from each other, then device assembly is easier, but temperature adjustment accuracy deteriorates
Solution Approach 1:
The heating electrode is formed integrally with the resonator electrodes on the same piezoelectric substrate, eliminating separate assembly steps. This integration ensures that the heating element and resonator are perfectly positioned relative to each other, achieving excellent temperature adjustment accuracy without compromising assembly ease.
Solution Approach 2:
A thermal conductive adhesive is used as an intermediary material between the heating element and piezoelectric resonator, ensuring efficient heat transfer while allowing for ease of assembly. The adhesive mediator maintains close thermal contact between components, improving temperature adjustment accuracy without making assembly difficult.
3Stability of the object's composition
If the piezoelectric resonator has larger heat capacity, then temperature stability is better, but heating speed deteriorates
Solution Approach 1:
The piezoelectric resonator is designed with a segmented electrode structure where heating electrodes and resonator electrodes are distributed across the substrate. This segmentation allows for optimized thermal management, enabling rapid heating through multiple heat sources while maintaining temperature stability through the distributed configuration.
Solution Approach 2:
Different regions of the piezoelectric substrate are assigned different functions: some areas serve as resonator regions while others serve as heating regions. This local quality differentiation allows the heating portions to rapidly increase temperature while the resonator portions maintain stable operating conditions, achieving both fast heating and temperature stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for rapid temperature elevation of the core section, reducing frequency fluctuations and maintaining a constant temperature, thereby stabilizing the oscillation frequency of the piezoelectric resonator device.
Implementation Method 1
at least whole of one main surface of the piezoelectric resonator is thermally coupled to the heating element
Implementation Method 2
it is possible to raise the temperature of the core section rapidly to a target temperature, which reduces frequency fluctuation of the piezoelectric resonator device
Data Source
AI summary
A piezoelectric resonator device according to one or more embodiments may include at least a core section. The core section includes: a three-ply structured crystal resonator in which a vibrating part is hermetically sealed; and a heater IC as a heating element. At least whole of a second main surface of a second sealing member of the crystal resonator is thermally coupled to the heater IC.