Resonator Via Electrode Inversion for Q-Factor
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional λ/4 resonators face challenges in achieving a good Q-factor due to current concentration at the short-circuit portion where the via electrode and shielding conductor connect, leading to increased resonator size when attempting to alleviate this through larger via diameters or more vias.
Innovation Solution
A resonator design featuring a via electrode portion within a dielectric substrate surrounded by shielding conductors, with strip lines connected to both ends of the via electrode, configuring a λ/2 resonator to concentrate current at the via electrode's center while preventing local current concentration in the shielding conductors, thereby improving the Q-factor without increasing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the via diameter is made larger or the number of vias is increased to eliminate current concentration in the short-circuit portion, then the Q-factor is improved, but the size of the resonator increases
Solution Approach 1:
Instead of connecting the via electrode directly to the shielding conductor (creating a short-circuit portion), the patent inverts the approach by having the via electrode extend beyond the shielding conductor to form a protruding portion. This reversal eliminates the short-circuit connection that caused current concentration, thereby improving the Q-factor without requiring larger vias or more vias that would increase resonator size.
2Volume of moving object
If a λ/4 resonator configuration is used to achieve downsizing, then the resonator size is reduced, but current concentration occurs at the short-circuit portion where the via electrode and shielding conductor contact
Solution Approach 1:
The patent maintains the compact λ/4 resonator configuration but inverts the connection approach: instead of the via electrode terminating at the shielding conductor, the via electrode protrudes beyond it. This inversion eliminates the harmful short-circuit contact while preserving the downsized structure, thus achieving both small size and good Q-factor.
Solution Approach 2:
The patent applies local quality by creating a specific structural feature - the protruding portion of the via electrode - at the critical location where the via electrode interacts with the shielding conductor. This localized structural modification eliminates current concentration at the short-circuit portion while maintaining the overall compact resonator design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances the Q-factor by concentrating current at the via electrode's center, preventing local concentration in the shielding conductors, and maintaining a compact resonator size.
Implementation Method 1
a via electrode portion formed inside a dielectric substrate; a plurality of shielding conductors formed in the dielectric substrate so as to surround the via electrode portion; a first strip line which is connected to one end of the via electrode portion and faces a first shielding conductor among the plurality of shielding conductors, inside the dielectric substrate; and a second strip line which is connected to another end of the via electrode portion and faces a second shielding conductor among the plurality of shielding conductors, inside the dielectric substrate
Data Source
AI summary
Provided are a resonator having a good Q value and a filter using the resonator. The resonator has: a via electrode portion formed inside a dielectric substrate; a plurality of shielding conductors formed on the dielectric substrate to surround the via electrode portion; a first strip line which is connected to one end of the via electrode portion in the dielectric substrate and faces a first shielding conductor among the plurality of shielding conductors; and a second strip line which is connected to the other end of the via electrode portion in the dielectric substrate and faces a second shielding conductor among the plurality of shielding conductors.