Retainer Assembly for LED Board Thermal Contact
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for attaching printed circuit boards to heat sinks, such as using screws, often result in reduced thermal transfer due to loosening or backout of screws and bowing of the board, which complicates repeatable and efficient heat dissipation, especially in light-emitting diode applications.
Innovation Solution
The use of retainer apparatuses, including top and locking retainers, that securely attach printed circuit boards to heat sinks without screws or adhesives, providing a consistent clamping force and contact through legs and lips, and optional thermally conductive adhesives for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws are used to attach printed circuit boards to heat sinks, then the board can be secured to the heat sink, but the screws tend to unscrew or back out, reducing contact and thermal transfer
Solution Approach 1:
The patent replaces the traditional screw-fastening mechanical system with a retainer assembly that uses elastic deformation and friction-based retention. The retainer applies continuous clamping force through its elastic body to secure the board to the heat sink, eliminating the backout problem of screws while maintaining reliable thermal contact.
Solution Approach 2:
The retainer assembly changes the mechanical parameters of attachment by using an elastic body that deforms under load to create friction-based retention. This elastic deformation mechanism provides consistent clamping force without the threaded fastening that causes screw backout, thereby improving thermal transfer reliability.
2Force
If screws are driven tightly to improve clamping force, then better contact is achieved, but the printed circuit board bends upwardly due to localized stress
Solution Approach 1:
The retainer assembly distributes the clamping force across multiple contact points along its length, rather than concentrating it at a single screw interface. This segmented force distribution prevents localized stress concentration that causes board bending, while still providing sufficient clamping force for thermal contact.
Solution Approach 2:
The elastic body of the retainer changes the force application parameter by using uniform elastic deformation across its length. This distributes clamping force evenly across the board-contact interface, preventing the upward bending caused by localized screw stress while maintaining adequate contact pressure for heat dissipation.
3Ease of operation
If screws are removed and reinserted to adjust positioning, then reattachability is improved, but the frictional hold is reduced and screws tend to loosen
Solution Approach 1:
The patent replaces the threaded fastening system with an elastic retention system. The retainer's elastic body maintains constant friction-based hold on the board without threads that can loosen. This allows repeated attachment and detachment operations while maintaining reliable attachment, as the elastic deformation continuously provides retention force without the frictional hold degradation that occurs with screws.
4Ease of manufacture
If traditional screw fastening is used, then attachment is achieved, but the process is complex and repeatable efficient heat dissipation is compromised
Solution Approach 1:
The retainer assembly merges the attachment function and the thermal contact function into a single integrated component. The elastic body simultaneously secures the board to the heat sink and maintains continuous thermal contact, eliminating the need for separate fastening operations and ensuring efficient heat dissipation.
Solution Approach 2:
The elastic retention mechanism replaces complex screw fastening operations with a simpler insert-and-retain process. The retainer's elastic deformation provides automatic retention without threaded fastening, simplifying assembly while ensuring consistent thermal contact for efficient heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures reliable and repeatable attachment of printed circuit boards to heat sinks, maintaining effective thermal transfer and preventing loosening, thereby improving heat dissipation and manufacturing efficiency.
Implementation Method 1
The heat sinks can be made of materials that are thermally conductive to more readily pull or conduct heat away from the printed circuit boards
Implementation Method 2
The retainer can be configured to provide a consistent clamping force between the board and the heat sink
Data Source
AI summary
An assembly includes a board, a heat sink, one or more retainers, and/or one or more light-emitting diode packages. The board includes a face surface, a rear surface opposite the face surface, and side edges. The one or more retainers are configured to secure the board to the heat sink. One or more light-emitting diode packages can be secured to the board for creating a light-emitting device assembly.