Retainer Ring Injection Molding for CMP Device Corrosion
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Solution Overview
Problem
The existing retainer rings in chemical mechanical polishing devices face issues with reliability, as the bonding force between metal and engineering plastic components weakens over time, leading to potential scratches and breakage of semiconductor wafers, and exposure of metal components to chemical polishing agents results in corrosion and particle formation, causing defects.
Innovation Solution
A method for manufacturing a retainer ring with a shell made of engineering plastic by coupling insert pins into a mold, injecting molten shell material to cover a metal insert ring member, and post-processing to form a robust and sealed retainer ring assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the mounting ring member is made of metal and the contact ring member is made of engineering plastic bonded together, then the retainer ring can provide structural support and chemical resistance, but the bonding force between the two members becomes weaker with the passage of time, leading to unreliable wafer support
Solution Approach 1:
The invention merges the mounting ring member and contact ring member into a single integrated structure where the engineering plastic contact ring member is directly formed on the metal mounting ring member through injection molding, eliminating the separate adhesive bonding step and its associated reliability issues over time
Solution Approach 2:
The invention uses composite construction by combining metal mounting ring member with engineering plastic contact ring member in a direct integral structure, where the metal provides structural support and the engineering plastic provides chemical resistance without requiring adhesive bonding between separate components
2Device complexity
If the mounting ring member made of metal is exposed to the outside, then the retainer ring can be structurally simple, but the chemical polishing agent becomes stuck to the metal surface, hardens, and causes defective semiconductor wafers
Solution Approach 1:
The invention covers the metal mounting ring member with an engineering plastic contact ring member that forms a protective shell, preventing the chemical polishing agent from contacting and sticking to the metal surface while maintaining the structural function of the retainer ring
Solution Approach 2:
The engineering plastic contact ring member serves as a sacrificial protective layer that prevents damage to the semiconductor wafers by absorbing the harmful interaction with chemical polishing agents, which can be replaced if needed
3Device complexity
If the mounting ring member made of metal is exposed to the outside, then the retainer ring structure is simple, but the metal is corroded by the chemical polishing agent
Solution Approach 1:
The engineering plastic contact ring member forms a protective barrier shell over the metal mounting ring member, preventing direct contact between the chemical polishing agent and the metal surface, thereby eliminating corrosion issues
Solution Approach 2:
The combination of metal mounting ring member and engineering plastic contact ring member creates a composite structure where the engineering plastic provides chemical corrosion resistance while the metal provides structural strength
4Ease of manufacture
If the retainer ring uses adhesive bonding to connect the mounting ring member and contact ring member, then the manufacturing process is simple, but the bonding force weakens over time causing wafers to be scratched or broken
Solution Approach 1:
The invention combines the mounting ring member and contact ring member into a single molded part where the engineering plastic is directly injected onto the metal substrate, eliminating the separate adhesive bonding step and preventing wafer damage from deteriorating bonds
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the durability and quality of the retainer ring, reducing defects and improving productivity by providing a reliable, corrosion-resistant, and particle-free environment for semiconductor wafer polishing.
Implementation Method 1
molding a shell member covering the insert ring member by injecting molten shell material into the mold in which the insert ring member is disposed
Data Source
AI summary
Disclosed herein is a method of manufacturing a retainer ring for a chemical mechanical polishing device. Insert pins are coupled to an insert ring member. The insert ring member is thereafter disposed in a mold such that a space is defined around the insert ring member in the mold. Subsequently, molten shell material is injected into the mold to form a shell member. Thereby, the retainer ring is manufactured, having a structure such that the insert ring member is completely covered with the shell member.