Retainer Thickness Variation for Substrate Stability
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Solution Overview
Problem
The existing substrate processing apparatuses suffer from retainer deformation during thermal processing, leading to stress concentration and substrate slippage due to uneven weight distribution, which causes creeps and slippage issues.
Innovation Solution
The substrate processing apparatus features a retainer with a thicker portion extending from the back region to a region adjacent to the substrate transfer plate, supported by a main body, which distributes the weight more evenly and reduces stress concentration, preventing deformation and slippage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If the retainer is made thinner to reduce weight, then the weight of the retainer is reduced, but the retainer deforms under thermal processing due to stress concentration
Solution Approach 1:
The retainer is designed with non-uniform thickness: a first thickness in the region contacting the substrate and a second thickness (greater than the first) in the region extending toward the back. This local quality variation allows the retainer to be lighter overall while maintaining sufficient strength and flatness in critical areas during thermal processing.
Solution Approach 2:
The retainer is segmented into regions with different thicknesses to distribute stress more effectively. The thinner region contacts the substrate where flexibility is beneficial, while the thicker region provides structural support and resists deformation under thermal processing conditions.
2Reliability
If the retainer is made thicker to prevent deformation, then the flatness of the retainer is maintained, but the weight of the retainer increases
Solution Approach 1:
Instead of making the entire retainer uniformly thick, the invention applies increased thickness only in the specific region extending from the substrate-contacting surface toward the back. This localized thickening prevents deformation in the critical stress-bearing area while minimizing overall weight increase.
3Ease of operation
If the weight of the substrate is concentrated on one point of the retainer, then the substrate is easily supported, but stress concentration occurs causing deformation and slippage
Solution Approach 1:
The retainer's thickness is segmented into at least two different values to distribute the substrate weight more evenly across the structure. This prevents stress concentration at any single point while maintaining effective substrate support, thereby preventing deformation and slippage during thermal processing.
Data Source
AI summary
Provided is a substrate processing apparatus comprising: a process chamber for processing a substrate; a heater for heating an interior of the process chamber; a holder for sustaining the substrate in the process chamber; and a substrate transfer plate for transferring the substrate to the holder; wherein the holder has a retainer for sustaining the substrate at its outer periphery and a main body for sustaining the retainer, a portion of the retainer extending at least from a back region thereof with respect to an inserting direction of the substrate transfer plate to a region adjacent thereto and to be sustained by the main body and lying outer than the substrate upon putting the substrate on the retainer being made thicker than other portions of the retainer.