Cylindrical Reticle Edge Bead Removal Apparatus
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Solution Overview
Problem
The photolithography process in semiconductor manufacturing faces contamination issues due to photoresist layers on the end edges of cylindrical reticles, which affect alignment and particle cleanliness in the photolithography apparatus.
Innovation Solution
An edge bead removal apparatus that clamps the cylindrical reticle at a predetermined angle and rotates it around a central axis, using an edge bead removal solvent nozzle to remove the photoresist layer from the edges, and inert gas nozzles to clean up any residue solvent.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If photoresist layer is formed on the end edges of cylindrical reticle, then the reticle can be properly coated, but contamination occurs on the reticle stage and alignment is affected
Solution Approach 1:
The patent applies preliminary action by removing the photoresist layer from the end edges of the cylindrical reticle before the exposure process. The edge bead removal unit is configured to remove the photoresist layer formed on the end edges of the cylindrical reticle, preventing contamination before it occurs during the exposure process.
Solution Approach 2:
The patent extracts the harmful photoresist layer from the end edges of the cylindrical reticle. The edge bead removal unit removes only the photoresist from the end edges while leaving the photoresist layer on the imaging area intact, thus separating the harmful portion from the useful portion.
2Productivity
If cylindrical reticle system is used to improve exposure efficiency, then productivity increases, but photoresist contamination on reticle stage occurs
Solution Approach 1:
The patent applies preliminary action by removing the photoresist layer from the end edges of the cylindrical reticle before the exposure process. The edge bead removal unit is configured to remove the photoresist layer formed on the end edges of the cylindrical reticle, preventing contamination before it occurs during the exposure process.
3Ease of manufacture
If photoresist layer remains on end edges, then coating is complete, but particle cleanliness deteriorates
Solution Approach 1:
The patent extracts the harmful photoresist layer from the end edges of the cylindrical reticle. The edge bead removal unit removes only the photoresist from the end edges while leaving the photoresist layer on the imaging area intact, thus separating the harmful portion from the useful portion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes photoresist layers from the edges of cylindrical reticles, preventing contamination and ensuring proper alignment and cleanliness within the photolithography apparatus, thereby enhancing the yield and efficiency of the exposure process.
Implementation Method 1
an edge bead removal solvent nozzle configured to spray an edge bead removal solvent to remove edge beads on both edges of the cylindrical reticle
Implementation Method 2
inert gas nozzles to clean up any residue solvent
Data Source
AI summary
An edge bead removal apparatus is provided. The edge bead removal apparatus includes a clamping unit configured to clamp a cylindrical reticle and cause the cylindrical reticle to incline with a pre-determined angle and to rotate around a central axis. The edge bead removal apparatus also includes an edge bead removal solvent nozzle configured to spray an edge bead removal solvent to remove edge beads on both edges of the cylindrical reticle.