Reticle OCM Layout for Alignment Without Sacrificing Die
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Solution Overview
Problem
The semiconductor industry faces challenges in aligning adjacent reticle exposure fields during photolithography, particularly with the increasing use of narrower scribe lines and laser scribing techniques, where optical control modules (OCMs) can be detrimental and result in a reduction in the number of saleable integrated circuit devices due to the need to sacrifice die positions for OCMs.
Innovation Solution
The method involves positioning OCMs within a single control module die such that they are shared across multiple reticle exposure fields, allowing for layer-to-layer alignment without sacrificing die positions, and using a reticle with an array region and margin regions to pattern integrated circuit devices, enabling partial overlap of reticle exposure fields to position OCMs within a single control module die, thus optimizing the number of integrated circuit devices that can be formed on a semiconductor substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If OCMs are positioned within scribe lines, then alignment of adjacent reticle exposure fields is achieved, but laser scribing techniques are detrimental and wide scribe lines are required
Solution Approach 1:
The patent moves OCMs from the traditional scribe line location to a new spatial arrangement where they are positioned within a single control module die that is shared across multiple reticle exposure fields. This dimensional repositioning allows OCMs to be located at the intersections of four adjacent reticle exposure fields, eliminating the need for wide scribe lines and enabling laser scribing techniques while maintaining alignment functionality.
2Ease of manufacture
If four-comer die configuration with OCMs is used, then structure-free scribe lines are achieved, but four die must be sacrificed as OCMs, decreasing overall number of saleable integrated circuit devices
Solution Approach 1:
The patent merges the functions of multiple OCMs into a single control module die. Instead of requiring four separate die positions for OCMs in the four-comer configuration, the invention positions OCMs within one shared control module die that serves multiple reticle exposure fields. This consolidation eliminates the need to sacrifice four die positions while maintaining alignment functionality across all adjacent fields.
3Measurement precision
If OCMs are positioned within scribe lines, then alignment reference is provided, but the presence of OCMs is detrimental to laser scribing techniques
Solution Approach 1:
The patent extracts OCMs from the scribe line region and repositions them within a shared control module die at the intersection of multiple reticle exposure fields. This extraction removes the harmful interaction between OCMs and laser scribing processes while preserving the alignment reference function. The OCMs remain in positions that provide necessary alignment references but no longer interfere with laser scribing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the number of integrated circuit devices that can be produced on a semiconductor substrate by reducing the need for dedicated OCM die positions, improving alignment accuracy, and facilitating easier singulation using laser scribing techniques, while maintaining or reducing fabrication costs.
Implementation Method 1
utilizing photolithography techniques. Such photolithography techniques utilize a separate reticle, which includes patterning information regarding an individual layer, to pattern each individual layer of the integrated circuit device
Implementation Method 2
Optical control modules (OCMs) are utilized to align adjacent reticle exposure fields. Photolithography systems can utilize OCMs as reference structures during the patterning process, thereby permitting adjacent reticle exposure fields to be aligned in a regular grid, or pattern, on the surface of the semiconductor substrate
Data Source
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AI summary
Optical control modules for integrated circuit device patterning and reticles and methods including the same. The methods include exposing, via a reticle, initial and subsequent reticle exposure fields on a surface of a semiconductor substrate. The initial and subsequent reticle exposure fields pattern corresponding array regions and margin regions on the semiconductor substrate. The initial and subsequent reticle exposure fields partially overlap such that an initial optical control module (OCM), which is patterned during exposure of the initial reticle exposure field, and a subsequent OCM, which is patterned during exposure of the subsequent reticle exposure field, both are positioned within a single control module die. The reticles include reticles that can be utilized during the methods or that can form the integrated circuit devices. The integrated circuit devices include integrated circuit devices formed utilizing the methods or the reticles.